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參數(shù)資料
| 型號： | NCP5181PG |
| 廠商： | ON SEMICONDUCTOR |
| 元件分類： | 通用總線功能 |
| 英文描述： | High Voltage High and Low Side Driver |
| 中文描述： | LINE DRIVER, PDIP8 |
| 封裝： | LEAD FREE, PLASTIC, DIP-8 |
| 文件頁數(shù)： | 11/12頁 |
| 文件大?。?/td> | 104K |
| 代理商： | NCP5181PG |
NCP5181
http://onsemi.com
11
PACKAGE DIMENSIONS
SOIC8 NB
CASE 75107
ISSUE AG
SEATING
PLANE
1
4
5
8
N
J
X 45
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 75101 THRU 75106 ARE OBSOLETE. NEW
STANDARD IS 75107.
A
B
S
D
H
C
0.10 (0.004)
DIM
A
B
C
D
G
H
J
K
M
N
S
MIN
4.80
3.80
1.35
0.33
MAX
5.00
4.00
1.75
0.51
MIN
0.189
0.150
0.053
0.013
MAX
0.197
0.157
0.069
0.020
INCHES
MILLIMETERS
1.27 BSC
0.10
0.19
0.40
0
0.25
5.80
0.050 BSC
0.004
0.007
0.016
0
0.010
0.228
0.25
0.25
1.27
8
0.50
6.20
0.010
0.010
0.050
8
0.020
0.244
X
Y
G
M
Y
M
0.25 (0.010)
Z
Y
M
0.25 (0.010)
Z
S
X
S
M
1.52
0.060
7.0
0.275
0.6
0.024
1.270
0.050
4.0
0.155
mm
inches
SCALE 6:1
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
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