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參數(shù)資料
| 型號(hào)： | NCP4896FCT1G |
| 廠商： | ON SEMICONDUCTOR |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 1.0 Watt Audio Power Amplifier with Earpiece Driving Capability |
| 中文描述： | 1.08 W, 1 CHANNEL, AUDIO AMPLIFIER, PBGA9 |
| 封裝： | LEAD FREE, FLIP CHIP, CSP-9 |
| 文件頁數(shù)： | 10/16頁 |
| 文件大?。?/td> | 141K |
| 代理商： | NCP4896FCT1G |
NCP4896
http://onsemi.com
10
TYPICAL PERFORMANCE CHARACTERISTICS
Figure 27. Power Dissipation vs. Output Power
0
0.2
0.7
0
0.1
P
D
,
P
out
, OUTPUT POWER (W)
Figure 28. Power Dissipation vs. Output Power
0
0.1
0.2
0.3
0.3
0
0.1
P
D
,
P
out
, OUTPUT POWER (W)
VP = 5 V
R
L
= 8
F = 1 kHz
THD + N < 0.1%
VP = 3.3 V
R
L
= 8
F = 1 kHz
THD + N < 0.1%
0.5
0.4
0.6
0.8
1
1.2
0.2
0.4
0.5
0.2
0.3
0.4
0.6
0.05
0.15
0.25
Figure 29. Power Dissipation vs. Output Power
0
0.1
0.2
0.3
0.4
0.25
0
0.05
P
D
,
P
out
, OUTPUT POWER (W)
Figure 30. Power Dissipation vs. Output Power
0
0.05
0.1
0.15
0.4
0.4
0
0.1
P
D
,
P
out
, OUTPUT POWER (W)
VP = 3 V
R
L
= 8
F = 1 kHz
THD + N < 0.1%
0.1
0.15
0.2
0.2
0.25
0.3
0.35
0.05
0.2
0.15
0.3
0.25
0.35
VP = 2.6 V
F = 1 kHz
THD + N < 0.1%
R
L
= 8
R
L
= 4
Figure 31. Power Derating 9Pin FlipChip CSP
0
20
160
700
0
P
D
,
T
A
, AMBIENT TEMPERATURE (
°
C)
Figure 32. Maximum Die Temperature vs.
PCB Heatsink Area
50
100
250
180
40
60
D
°
C
A
°
C
PCB HEATSINK AREA (mm
2
)
120
150
200
100
200
300
400
500
600
80
100
160
140
P
Dmax
= 633 mW
for VP = 5 V,
R
L
= 8
40
60
80
100
120
140
PCB Heatsink Area
500 mm
2
50 mm
2
200 mm
2
300
Maximum Die Temperature 150
°
C
VP = 2.6 V
VP = 5 V
VP = 3.3 V
VP = 4.2 V
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