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參數資料
| 型號： | NCP4894MNR2G |
| 廠商： | ON Semiconductor |
| 文件頁數： | 10/19頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC AMP AUDIO PWR 1W DIFF 10-DFN |
| 標準包裝： | 1 |
| 類型： | AB 類 |
| 輸出類型： | 1-通道（單聲道） |
| 在某負載時最大輸出功率 x 通道數量： | 1.8W x 1 @ 8 歐姆 |
| 電源電壓： | 2.2 V ~ 5.5 V |
| 特點： | 消除爆音，差分輸入，短路和熱保護，關閉 |
| 安裝類型： | 表面貼裝 |
| 供應商設備封裝： | 10-DFN（3x3） |
| 封裝/外殼： | 10-VFDFN 裸露焊盤 |
| 包裝： | 剪切帶 (CT) |
| 其它名稱： | NCP4894MNR2GOSCT |
NCP4894
http://onsemi.com
18
PACKAGE DIMENSIONS
DFN10
MN SUFFIX
CASE 485C01
ISSUE A
10X
SEATING
PLANE
L
D
E
0.15 C
A
A1
e
D2
E2
b
15
10
6
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. TERMINAL b MAY HAVE MOLD COMPOUND
MATERIAL ALONG SIDE EDGE. MOLD
FLASHING MAY NOT EXCEED 30 MICRONS
ONTO BOTTOM SURFACE OF TERMINAL b.
6. DETAILS A AND B SHOW OPTIONAL VIEWS
FOR END OF TERMINAL LEAD AT EDGE OF
PACKAGE.
B
A
0.15 C
TOP VIEW
SIDE VIEW
BOTTOM VIEW
PIN 1
REFERENCE
0.10 C
0.08 C
(A3)
C
10X
0.10 C
0.05 C
A B
NOTE 3
K
10X
DIM
MIN
MAX
MILLIMETERS
A
0.80
1.00
A1
0.00
0.05
A3
0.20 REF
b
0.18
0.30
D
3.00 BSC
D2
2.45
2.55
E
3.00 BSC
E2
1.75
1.85
e
0.50 BSC
L
0.35
0.45
L1
0.00
0.03
DETAIL A
K
0.19 TYP
2X
L1
DETAIL A
Bottom View
(Optional)
A1
A3
DETAIL B
Side View
(Optional)
EDGE OF PACKAGE
MOLD CMPD
EXPOSED Cu
DETAIL B
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
2.1746
2.6016
1.8508
0.5000 PITCH
0.5651
10X
3.3048
0.3008
10X
DIMENSIONS: MILLIMETERS
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