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參數(shù)資料
| 型號： | NCP2809BGEVB |
| 廠商： | ON Semiconductor |
| 文件頁數(shù)： | 14/24頁 |
| 文件大?。?/td> | 0K |
| 描述： | EVAL BOARD FOR NCP2809B |
| 設(shè)計資源： | NCP2809B Demo Brd Schematic NCP2809B EVB BOM NCP2809BGEVB Gerber Files |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | NOCAP™ |
| 放大器類型： | AB 類 |
| 輸出類型： | 耳機(jī)，2-通道（立體聲） |
| 在某負(fù)載時最大輸出功率 x 通道數(shù)量： | 135mW x 2 @ 16 歐姆 |
| 電源電壓： | 2.2 V ~ 5.5 V |
| 板類型： | 完全填充 |
| 已用 IC / 零件： | NCP2809 |
| 已供物品： | 板 |
| 其它名稱： | NCP2809BEVBOS NCP2809BEVBOS-ND NCP2809BGEVBOS |
NCP2809 Series
http://onsemi.com
21
Table 1. Bill of Material Micro10
Item
Part Description
Ref.
PCB
Footprint
Manufacturer
Reference
1
NCP2809 Audio Amplifier
U1,U3
Micro10
ON Semiconductor
NCP2809
2
SMD Resistor 100 KW
R1,R2
0805
VishayDraloric
D12CRCW Series
3
Ceramic Capacitor 390 nF 50 V Z5U
C2,C4,
C6,C8
1812
Kemet
C1812C394M5UAC
4
Ceramic Capacitor 1.0 mF 16 V X7R
Optimized Performance
C1,C3,
C5,C7
1206
Murata
GRM426X7R105K16
5
Tantalum Capacitor 220 mF 10 V
C9,C10
Kemet
T495X227010AS
6
I/O Connector. It can be plugged by
BLZ5.08/2 (Weidmüller Reference)
J4,J10
Weidmüller
SL5.08/2/90B
7
I/O Connector. It can be plugged by
BLZ5.08/3 (Weidmüller Reference)
J2,J3,
J8,J9
Weidmüller
SL5.08/3/90B
8
3.5 mm PCB Jack Connector
U2,U4
DecelectForgos
IES 1013
9
Jumper Header Vertical Mount
2*1, 2.54 mm
J1,J7
Table 2. Bill of Material UDFN10
Item
Part Description
Ref.
PCB Footprint
Manufacturer
Manufacturer Part Number
1
Stereo Headphone Amplifier
U1
UDFN10 3x3
ON Semiconductor
NCP2809B
2
Thick Film Chip Resistor
R1R5
0805
Vishay
CRCW08052022FNEA
3
Ceramic Chip Capacitor
C1,C2,C5,C7
0805
TDK
C2012X7R1C105K
4
PCB Header, 2 Poles
J5
NA
Phoenix
MSTBA 2,5/2G
5
SMB Connector
J1,J2,J8
NA
RS
RS 5463406
6
3.5 mm PCB Jack Connector
U2
NA
CUI Inc
SJ3515N
7
Short Connector
J14,J15
NA
8
Short Connector
J24,J25
NA
PCB LAYOUT GUIDELINES
How to Optimize the Accuracy of VMC
The main innovation of the NCP2809 stereo NOCAP
audio amplifier is the use of a virtual ground that allows
connecting directly the headset on the outputs of the device
saving DCblocking output capacitors. In order to have the
best performances in terms of crosstalk, noise and supply
current, the feedback connection on the virtual ground
amplifier is not closed internally. To reach this goal of
excellence, one must connect OUT_I and REF_I as close
as possible from the middle point of the output jack
connector. The most suitable place for this connection is
directly on the pad of this middle point.
How to Optimize THD+N Performances
To get the best THD+N level on the headset speakers, the
traces of the power supply, ground, OUT_R, OUT_L and
OUT_I need the lowest resistance. Thus, the PCB traces for
these nets should be as wide and short as possible.
You need to avoid ground loops, run digital and analog
traces parallel to each other. Due to its internal structure,
the amplifier can be sensitive to coupling capacitors
between Ground and each output (OUT_R, OUT_L and
OUT_I). Avoid running the output traces between two
ground layers or if traces must cross over on different
layers, do it at 90 degrees.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| NCP2809BMUTXG | 功能描述:音頻放大器 HEADSET AUDIO AMPLFR RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| NCP2811 | 制造商:ONSEMI 制造商全稱:ON Semiconductor 功能描述:NOCAP Advanced Stereo Headphone Amplifier |
| NCP2811ADTBR2G | 功能描述:音頻放大器 HEADSET AUDIO AMP RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| NCP2811ADTBRGEVB | 功能描述:BOARD EVAL NCP2811 RoHS:是 類別:編程器，開發(fā)系統(tǒng) >> 評估板 - 音頻放大器 系列:* 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1 系列:- |
| NCP2811AFCT1G | 功能描述:音頻放大器 HEADSET AUDIO AMPLIFIER RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
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