參數(shù)資料
型號: NCP1654BD133R2G
廠商: ON Semiconductor
文件頁數(shù): 2/23頁
文件大?。?/td> 228K
描述: IC PFC CCM 133KHZ 8-SOIC
標(biāo)準(zhǔn)包裝: 2,500
模式: 連續(xù)導(dǎo)電(CCM)
頻率 - 開關(guān): 120kHz ~ 146kHz
電流 - 啟動: 75µA
電源電壓: 9 V ~ 20 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 8-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 8-SOICN
包裝: 帶卷 (TR)
其它名稱: NCP1654BD133R2G-ND
NCP1654BD133R2GOSTR
NCP1654
http://onsemi.com
2
MAXIMUM RATINGS TABLE
Symbol
Pin
Rating
Value
Unit
DRV
8
Output Drive Capability  Source
Output Drive Capability  Sink
1.5
+1.5
A
V
CC
7
Power Supply Voltage, V
CC
 pin, continuous voltage
0.3, +20
V
7
Transient Power Supply Voltage, duration < 10 ms, IV
CC
 < 10 mA
+25
V
Vin
2, 3, 4, 5, 6
Input Voltage
0.3, +10
V
P
D
(SO)
R
q
JA
(SO)
Power Dissipation and Thermal Characteristics
D suffix, Plastic Package, Case 751
Maximum Power Dissipation @ T
A
 = 70癈
Thermal Resistance JunctiontoAir
450
178
mW
癈/W
T
J
Operating Junction Temperature Range
40 to +125
T
Jmax
Maximum Junction Temperature
150
T
Smax
Storage Temperature Range
65 to +150
T
Lmax
Lead Temperature (Soldering, 10 s)
300
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1.  This device series contains ESD protection and exceeds the following tests:
Human Body Model (HBM) 2000 V per JEDEC standard JESD22, Method A114E
Machine Model (MM) 200 V (except pin#7 which complies 150 V) per JEDEC standard JESD22, Method A115A.
2.  This device contains Latchup Protection and exceeds ?00 mA per JEDEC Standard JESD78.
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