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NBVSPA013
http://onsemi.com
3
Table 4. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Units
VDD
Positive Power Supply
GND = 0 V
4.6
V
VIN
Control Input (VC and OE)
VIN ≤ VDD + 200 mV
VIN ≥ GND 200 mV
V
IOSC
Output Short Circuit Current
CLK to CLK
CLK or CLK to GND
Continuous
12
24
mA
TA
Operating Temperature Range
40 to +85
°C
Tstg
Storage Temperature Range
55 to +120
°C
Tsol
Wave Solder
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 5. DC CHARACTERISTICS (VDD = 2.5 V ±5%, GND = 0 V, TA = 40°C to +85°C) (Note 2) Symbol
Characteristic
Conditions
Min.
Typ.
Max.
Units
IDD
Power Supply Current
75
100
mA
VIH
OE and FSEL Input HIGH Voltage
2000
VDD
mV
VIL
OE and FSEL Input LOW Voltage
GND 300
800
mV
IIH
Input HIGH Current
OE
100
+100
mA
IIL
Input LOW Current
OE
100
+100
mA
DVOD
Change in Magnitude of VOD for
Complementary Output States
0
1
25
mV
VOS
Offset Voltage
1125
1375
mV
DVOS
Change in Magnitude of VOS for
Complementary Output States
0
1
25
mV
VOH
Output HIGH Voltage
1425
1600
mV
VOL
Output LOW Voltage
900
1075
mV
VOD
Differential Output Voltage
250
450
mV
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 Ifpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
2. Measurement taken with outputs terminated with 100 ohm across differential pair. See Figure
4.3. Parameter guaranteed by design verification not tested in production.