參數(shù)資料
型號(hào): NAND128W4A0AZA1F
廠商: STMICROELECTRONICS
元件分類: PROM
英文描述: 8M X 16 FLASH 3V PROM, 35 ns, PBGA55
封裝: 8 X 10 MM, 1 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-55
文件頁(yè)數(shù): 49/57頁(yè)
文件大?。?/td> 916K
代理商: NAND128W4A0AZA1F
53/57
NAND128-A, NAND256-A, NAND512-A, NAND01G-A
PART NUMBERING
Table 28. Ordering Information Scheme
Devices are shipped from the factory with the memory content bits, in valid blocks, erased to ’1’.
For further information on any aspect of this device, please contact your nearest ST Sales Office.
Example:
NAND512R3A
0
A ZA
1
T
Device Type
NAND = NAND Flash Memory
Density
128 = 128Mb
256 = 256Mb
512 = 512Mb
01G = 1Gb
Operating Voltage
R = VDD = 1.7 to 1.95V
W = VDD = 2.7 to 3.6V
Bus Width
3 = x8
4 = x16
Family Identifier
A = 528 Bytes/ 264 Word Page
Device Options
0 = No Options
2 = Chip Enable Don’t Care Enabled
Product Version
A = First Version
B = Second Version
C = Third Version
Package
N = TSOP48 12 x 20mm (all devices)
V = USOP48 12 x 17 x 0.65mm (128Mbit, 256Mbit and 512Mbit devices)
ZA = VFBGA55 8 x 10 x 1mm, 6x8 ball array, 0.8mm pitch (128Mbit and 256Mbit devices)
ZB = TFBGA55 8 x 10 x 1.2mm, 6x8 ball array, 0.8mm pitch (512Mbit Dual Die devices)
ZA = VFBGA63 9 x 11 x 1mm, 6x8 ball array, 0.8mm pitch (512Mbit devices)
ZB = TFBGA63 9 x 11 x 1.2mm, 6x8 ball array, 0.8mm pitch (1Gbit Dual Die devices)
Temperature Range
1 = 0 to 70 °C
6 = –40 to 85 °C
Option
blank = Standard Packing
T = Tape & Reel Packing
E = Lead Free Package, Standard Packing
F = Lead Free Package, Tape & Reel Packing
相關(guān)PDF資料
PDF描述
NAND128W4A2BZA1F 8M X 16 FLASH 3V PROM, 35 ns, PBGA55
NAND512W3A0AZA1E 64M X 8 FLASH 3V PROM, 35 ns, PBGA63
NAND512W3A2BN1E 64M X 8 FLASH 3V PROM, 35 ns, PDSO48
NAND512W3A0AV1E 64M X 8 FLASH 3V PROM, 35 ns, PDSO48
NAND128R3A0CV6T 16M X 8 FLASH 1.8V PROM, 35 ns, PDSO48
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