參數(shù)資料
型號: NAND04GR3B3AN6
廠商: NUMONYX
元件分類: PROM
英文描述: 512M X 8 FLASH 1.8V PROM, 35 ns, PDSO48
封裝: 12 X 20 MM, PLASTIC, TSOP-48
文件頁數(shù): 32/59頁
文件大?。?/td> 998K
代理商: NAND04GR3B3AN6
NAND512-B, NAND01G-B, NAND02G-B, NAND04G-B, NAND08G-B
38/59
Hardware Simulation Models
Behavioral simulation models. Denali Software
Corporation models are platform independent
functional models designed to assist customers in
performing entire system simulations (typical
VHDL/Verilog). These models describe the logic
behavior and timings of NAND Flash devices, and
so allow software to be developed before hard-
ware.
IBIS simulations models. IBIS (I/O Buffer Infor-
mation Specification) models describe the behav-
ior of the I/O buffers and electrical characteristics
of Flash devices.
These models provide information such as AC
characteristics, rise/fall times and package me-
chanical data, all of which are measured or simu-
lated at voltage and temperature ranges wider
than those allowed by target specifications.
IBIS models are used to simulate PCB connec-
tions and can be used to resolve compatibility is-
sues when upgrading devices. They can be
imported into SPICETOOLS.
相關PDF資料
PDF描述
NAND512W3B3BZA1F 64M X 8 FLASH 3V PROM, 35 ns, PBGA63
NAND512W3B3CV1 64M X 8 FLASH 3V PROM, 35 ns, PDSO48
NAND01GR4B3AV1F 64M X 16 FLASH 1.8V PROM, 35 ns, PDSO48
NAND01GW4B3CZA1E 64M X 16 FLASH 3V PROM, 35 ns, PBGA63
NAND08GR4B2AZC6E 512M X 16 FLASH 1.8V PROM, 35 ns, PBGA63
相關代理商/技術參數(shù)
參數(shù)描述
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NAND04GR4B2EN6E 制造商:Micron Technology Inc 功能描述:NAND - Trays
NAND04GR4B2EN6F 制造商:Micron Technology Inc 功能描述:NAND - Tape and Reel
NAND04GW3B2AN6E 制造商:Micron Technology Inc 功能描述:FLASH PARALLEL 3V/3.3V 4GBIT 512MX8 25US 48TSOP - Trays
NAND04GW3B2BE06 功能描述:閃存 NAND & S.MEDIA FLASH RoHS:否 制造商:ON Semiconductor 數(shù)據(jù)總線寬度:1 bit 存儲類型:Flash 存儲容量:2 MB 結構:256 K x 8 定時類型: 接口類型:SPI 訪問時間: 電源電壓-最大:3.6 V 電源電壓-最小:2.3 V 最大工作電流:15 mA 工作溫度:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體: 封裝:Reel