參數(shù)資料
型號: NAND01GR3A1AN1F
廠商: NUMONYX
元件分類: PROM
英文描述: 128M X 8 FLASH 1.8V PROM, 15000 ns, PDSO48
封裝: 12 X 20 MM, LEAD FREE, PLASTIC, TSOP-48
文件頁數(shù): 48/56頁
文件大?。?/td> 882K
代理商: NAND01GR3A1AN1F
NAND128-A, NAND256-A, NAND512-A, NAND01G-A
52/56
PART NUMBERING
Table 28. Ordering Information Scheme
Devices are shipped from the factory with the memory content bits, in valid blocks, erased to ’1’.
For further information on any aspect of this device, please contact your nearest ST Sales Office.
Example:
NAND512R3A
0
A ZA
1
T
Device Type
NAND = NAND Flash Memory
Density
128 = 128Mb
256 = 256Mb
512 = 512Mb
01G = 1Gb
Operating Voltage
R = VDD = 1.7 to 1.95V
W = VDD = 2.7 to 3.6V
Bus Width
3 = x8
4 = x16
Family Identifier
A = 528 Bytes/ 264 Word Page
Device Options
0 = No Options
1 = Automatic Page 0 Read at Power-up
2 = Chip Enable Don’t Care Enabled
3 = Chip Enable Don’t Care Enabled and Automatic Page 0 Read at Power-up
Product Version
A = 120nm process technology
(Single Die 128Mb, 256Mb, 512Mb) (Dual Die 512Mb, 1Gb)
Package
N = TSOP48 12 x 20mm (all devices)
V = WSOP48 12 x 17 x 0.65mm (128Mbit, 256Mbit and 512Mbit devices)
ZA = VFBGA55 8 x 10 x 1mm, 6x8 ball array, 0.8mm pitch (128Mbit and 256Mbit devices)
ZB = TFBGA55 8 x 10 x 1.2mm, 6x8 ball array, 0.8mm pitch (512Mbit Dual Die devices)
ZA = VFBGA63 8.5 x 15 x 1mm, 6x8 ball array, 0.8mm pitch (512Mbit devices)
ZB = TFBGA63 8.5 x 15 x 1.2mm, 6x8 ball array, 0.8mm pitch (1Gbit Dual Die devices)
Temperature Range
1 = 0 to 70 °C
6 = –40 to 85 °C
Option
blank = Standard Packing
T = Tape & Reel Packing
E = Lead Free Package, Standard Packing
F = Lead Free Package, Tape & Reel Packing
相關(guān)PDF資料
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NAND01GR4A3AZB6F 64M X 16 FLASH 1.8V PROM, 15000 ns, PBGA63
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NAND512R4A1AV6 32M X 16 FLASH 1.8V PROM, 15000 ns, PDSO48
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
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