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參數(shù)資料
| 型號： | MXFG81XX5000 |
| 廠商： | MURATA MANUFACTURING CO LTD |
| 元件分類： | 連接器件 |
| 英文描述： | INTERCONNECTION DEVICE |
| 文件頁數(shù)： | 3/4頁 |
| 文件大小： | 139K |
| 代理商： | MXFG81XX5000 |
324
CG01-I
HIGH FREQUENCY DEVICES
COAXIAL CONNECTORS
SMT, MICROMINIATURE
FSC Series
APPLICATION NOTES
s Stress limit to the connector: When connected, stress to
the connector should be limited as shown in Fig. 1.
s PCB mounting pattern dimensions: Dimensions shown
on page 323 “Recommended Mounting Dimensions”
should be used for PCB design.
s Disengagement and engagement:
Use tool P/N M19000. The connector to be disengaged
and engaged should be pulled out or insert to the vertical
direction using the tool. Do not try and pull out the cable
by hand or wire breakage may result.
s Cable and connector handling: Do not apply a twisting
torque to the cable and connector.
s REFLOW SOLDERING CONDITION: Reflow soldering
should be carried out according to condition shown
in Fig. 4.
1. Stress to the housing.
Stress A and B: 4.9N (0.5kgf) max.
2. Stress to the outer sleeve.
Stress C: 2.94N (0.3kgf) max.
Stress D: 1.96N (0.2kgf) max.
3. Stress to the cable.
Stress E: 4.9N (0.5kgf) max. for 81 cable
7.84N (0.8kgf) max. for 76 cable
STRESS TO THE CONNECTOR (Fig. 1)
DISENGAGEMENT TOOL (Fig. 2): mm
A
B
C
D
5 ± 0.6
0.5 ± 0.6
3.5 ± 0.6
2 ± 0.6
20 ± 2
45 ± 2
5±1
2.7 ± 1
E
M19000
SMA-FSC ADAPTERS (Fig. 3): mm
8.64
14.06
4.4
5.08
13.93
0.76
3.1
1.48
SMA – JACK
FSC – MALE
FSC – FEMALE
MM121460 (For FSC type receptacle)
STANDARD REFLOW SOLDERING
CONDITIONS (Fig. 4)
MM121454 (For FSC type cable assembly)
How to use disengagement tool
5
±
0.6
5.33
2.5
1.33
5.33
2.5
2.16
2.5
30
60
90
120
150
180
Allowable temperature and time of reflow soldering
T
e
mperature
(°C)
260
250
240
230
220
210
200
190
180
Time [sec.]
Solder : Sn60%– Pb40%
Pre-heating 150 ± 10°C
60 ~ 120 sec.
20 ~ 30 sec. max.
10 sec. max.
Peak temperature 225 ± 5°C
T
emperature
(°C)
220
200
150
100
25
0
Time [sec.]
Measuring point of temperature in-out terminals of the device.
Reflow Soldering
Hot air
Both convection and infrared rays
Hot plate
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