sensing to be achieved with the MEMSIC device (reference
application note AN-00MX-007).
MEMSIC MXA6500E
Rev.B
Page 5 of 6
3/22/2005
M
Accelerometer Position Relative to Gravity
X-Axis
X Output
(
g
)
of tilt
(m
g
)
1.000
0.15
0.996
1.37
0.985
2.88
0.940
5.86
0.866
8.59
0.707
12.23
0.500
15.04
0.342
16.35
0.174
17.16
0.087
17.37
0.000
17.45
Changes in Tilt for X- and Y-Axes
X-Axis
Orientation
To Earth’s
Surface
(deg.)
90
85
80
70
60
45
30
20
10
5
0
Y-Axis
Change
per deg.
Y Output
(
g
)
Change
per deg.
of tilt
(m
g
)
17.45
17.37
17.16
16.35
15.04
12.23
8.59
5.86
2.88
1.37
0.15
0.000
0.087
0.174
0.342
0.500
0.707
0.866
0.940
0.985
0.996
1.000
Resolution
: The accelerometer resolution is limited by
noise. The output noise will vary with the measurement
bandwidth. With the reduction of the bandwidth, by
applying an external low pass filter, the output noise drops.
Reduction of bandwidth will improve the signal to noise
ratio and the resolution. The output noise scales directly
with the square root of the measurement bandwidth. The
maximum amplitude of the noise, its peak- to- peak value,
approximately defines the worst case resolution of the
measurement. With a simple RC low pass filter, the rms
noise is calculated as follows:
Noise (mg rms) = Noise(mg/
Hz
) *
The peak-to-peak noise is approximately equal to 6.6 times
the rms value (for an average uncertainty of 0.1%).
)
*
)
(
(
Hz
Bandwidth
POWER SUPPLY NOISE REJECTION
One capacitor is recommended for best rejection of power
supply noise (reference figure below). The capacitor should
be located as close as possible to the device supply pin
(V
DD
). The capacitor lead length should be as short as
possible, and surface mount capacitor is preferred. For
typical applications, the capacitor can be ceramic 0.1 μF.
Power Supply Noise Rejection
PCB LAYOUT AND FABRICATION SUGGESTIONS
1. It is best to solder a 0.1uF capacitor directly across V
DD
and COM pin.
2. Robust low inductance ground wiring should be used.
3. Care should be taken to ensure there is “thermal
symmetry” on the PCB immediately surrounding the
MEMSIC device and that there is no significant heat
source nearby.
4. A metal ground plane should be added directly beneath
the MEMSIC device. The size of the plane should be
similar to the MEMSIC device’s footprint and be as
thick as possible.
5. Vias can be added symmetrically around the ground
plane. Vias increase thermal isolation of the device
from the rest of the PCB.