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參數(shù)資料
| 型號： | MVR32HXBRN |
| 廠商： | Rohm CO.,LTD. |
| 元件分類： | 數(shù)字電位計 |
| 英文描述： | Chip trimmer potentiometers |
| 中文描述： | 芯片微調電位器 |
| 文件頁數(shù)： | 3/9頁 |
| 文件大小： | 134K |
| 代理商： | MVR32HXBRN |
MVR32
Resistors
Characteristics
Test method (JIS C 5261)
Specifications
Terminal strength
(bending)
Resistance to
soldering heat
Solderability
Terminal strength
(compression)
Total resistance change rate :
±
(3.0%
+
0.1
)
There must be no mechanical damage.
Total resistance change rate:
±
(3.0%
+
0.1
)
Constriction contact resistance rate: 5% or less
95% of terminal surface must be covered by
new soldering, and there must be no
soldering corrosion.
Total resistance change rate :
±
(3.0%
+
0.1
)
There must be no mechanical damage.
JIS C 5261 6.5
Duration of pressure : 5
±
1s
Amount of bending : 3 mm
JIS C 5261 6.7
Soldering conditions : 260
±
5
C
Soldering time : 10
±
1s.
JIS C 5261 6.8
Flux : Rosin methanol or rosin isopropyl alcohol
Solde r: H63A
Soldering conditions : 235
±
5
C
Soldering time : 2.0
±
0.5s.
JIS C 5261 6.5
Force (4.9N) is applied from three directions upon the middle of the
sides of the sample on the surface being tested, as shown in the
illustration on the left.
!
External dimensions
(Units : mm)
A
F
C
D
G
H
O
O
E
T3
T2
T1
I
B
P
L
K
Q
M
N
J
Substrate Alumina substrate (96% alumina or greater)
Dielectric glaze oxide dielectric glaze
Eyelet Stainless steel + metal plating
Wiper Stainless steel
(Internal) Primary electrode with thick film
of palladium-silver
Electrode (External) Soldering tip
Protective film Organic film
A
B
C
D
E
I
J
K
L
M
3.0
±
0.1
1.5
±
0.1
1.5
±
0.1
1.6
±
0.1
1.0
±
0.15
N
0.9
±
0.1
F
2.6
±
0.1
O
0.35
±
0.1 Max. 0.65 Max. 1.1
G
Max. 3.6
P
H
1.9
±
0.05
Q
0.5
±
0.05
Max. 1.3
1.15
±
0.1
0.7
±
0.1
0.18
±
0.05
Part
Material
Electrode
(Units : mm)
!
Equivalent circuit
T: terminal
T1
T3
T2
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