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參數(shù)資料
| 型號： | MT933 |
| 廠商： | Mitel Networks Corporation |
| 英文描述： | () |
| 中文描述： | （） |
| 文件頁數(shù)： | 4/6頁 |
| 文件大小： | 38K |
| 代理商： | MT933 |
MSAN-182
Application Note
4
5.0
Power Planes
When connecting the various power supplies to the
MT933 it is important to reduce noise coupling. The
decoupling devices need to be located as close to
the VDD pins as possible. Connections from the
power pins to the planes should use wide traces
(except substrate VDD pins 1 & 33 – see next
section). To further reduce crosstalk we recommend
splitting the Vcc Power Planes into three sections as
in figure 1. A digital or TTL plane (DIGVDD), a
Transmit VDD plane (TXVDD), and a Receive VDD
plane (RXVDD). An alternative is to split the ground
plane in the same way or even split both planes.
Areas that are very small (<<1 square inch) may lose
any planar advantages and in these cases it may be
necessary to combine the 2 analog planes into 1, or
even combine all 3 planes.
6.0
Further Recommendations
Here are some additional recommendations based
on experiments carried out in the lab. They should be
followed if space allows.
Split the ground plane as well as and in the
same way as the VDD plane (see Figure 1).
An alternative to using ferrite beads (which may
trap noise) is to star-route the power supply to
the 3 power planes.
Route the substrate VDD pins (pins 1 & 33) via
normal width tracks to the RX VDD plane.
The point where the TX load resistors connect
to ground should be as far from the chip as
possible, as close to the power supply as
possible, and decoupled with 100nF caps.
The resistors on TXREF10 & TXREF100 should
be as far from the chip as possible and as close
as possible to the power supply.
If using an oscillator module they can produce
large overshoot, so it is recommended to add a
100ohm resistor on the output of the module
followed by a 15pF capacitor to ground.
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