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| 型號： | MSP430F2370IRHAT |
| 廠商： | Texas Instruments |
| 文件頁數(shù)： | 27/65頁 |
| 文件大小： | 0K |
| 描述： | IC MCU 16BIT 32K FLASH 40-QFN |
| 產(chǎn)品培訓模塊： | The Ultra-Low Power MSP430 MSP430 Overview MSP430 Design Tools MSP430 Peripherals MSP430x2xx/4xx and Wireless Overview Portable Medical Solutions with MSP430 MSP430 for Utility Metering Solutions MSP430: How to JTAG MSP430, How To Use the Clock System Grace Software Graphical User Interface MCU Overview Driver Library MSP430Ware Overview |
| 標準包裝： | 1 |
| 系列： | MSP430F2xx |
| 核心處理器： | RISC |
| 芯體尺寸： | 16-位 |
| 速度： | 16MHz |
| 連通性： | I²C，IrDA，LIN，SCI，SPI，UART/USART |
| 外圍設(shè)備： | 欠壓檢測/復位，POR，PWM，WDT |
| 輸入/輸出數(shù)： | 32 |
| 程序存儲器容量： | 32KB（32K x 8 + 256B） |
| 程序存儲器類型： | 閃存 |
| RAM 容量： | 2K x 8 |
| 電壓 - 電源 (Vcc/Vdd)： | 1.8 V ~ 3.6 V |
| 數(shù)據(jù)轉(zhuǎn)換器： | 斜率 A/D |
| 振蕩器型： | 內(nèi)部 |
| 工作溫度： | -40°C ~ 85°C |
| 封裝/外殼： | 40-VFQFN 裸露焊盤 |
| 包裝： | 標準包裝 |
| 產(chǎn)品目錄頁面： | 712 (CN2011-ZH PDF) |
| 其它名稱： | 296-21750-6 |
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MSP430F23x0
SLAS518E
– AUGUST 2006 – REVISED AUGUST 2011
Crystal Oscillator LFXT1, High-Frequency Mode
(1)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX
UNIT
LFXT1 oscillator crystal
fLFXT1,HF0
XTS = 1, XCAPx = 0, LFXT1Sx = 0
1.8 V to 3.6 V
0.4
1
MHz
frequency, HF mode 0
LFXT1 oscillator crystal
fLFXT1,HF1
XTS = 1, XCAPx = 0, LFXT1Sx = 1
1.8 V to 3.6 V
1
4
MHz
frequency, HF mode 1
1.8 V to 3.6 V
2
10
LFXT1 oscillator crystal
fLFXT1,HF2
XTS = 1, XCAPx = 0, LFXT1Sx = 2
2.2 V to 3.6 V
2
12
MHz
frequency, HF mode 2
3 V to 3.6 V
2
16
1.8 V to 3.6 V
0.4
10
LFXT1 oscillator logic-level
fLFXT1,HF,logic
square-wave input
XTS = 1, XCAPx = 0, LFXT1Sx = 3
2.2 V to 3.6 V
0.4
12
MHz
frequency, HF mode
3 V to 3.6 V
0.4
16
XTS = 1, XCAPx = 0, LFXT1Sx = 0,
2700
fLFXT1,HF = 1 MHz, CL,eff = 15 pF
Oscillation allowance for HF
XTS = 1, XCAPx = 0, LFXT1Sx = 1,
OAHF
crystals (see Figure 17 and
800
fLFXT1,HF = 4 MHz, CL,eff = 15 pF
XTS = 1, XCAPx = 0, LFXT1Sx = 2,
300
fLFXT1,HF = 16 MHz, CL,eff = 15 pF
Integrated effective load
CL,eff
XTS = 1, XCAPx = 0(3)
1
pF
capacitance, HF mode(2)
XTS = 1, XCAPx = 0,
Measured at P2.0/ACLK,
40
50
60
fLFXT1,HF = 10 MHz
Duty cycle, HF mode
2.2 V/3 V
%
XTS = 1, XCAPx = 0,
Measured at P2.0/ACLK,
40
50
60
fLFXT1,HF = 16 MHz
fFault,HF
Oscillator fault frequency (4)
XTS = 1, XCAPx = 0, LFXT1Sx = 3(5)
2.2 V/3 V
30
300
kHz
(1)
To improve EMI on the XT2 oscillator the following guidelines should be observed:
(a) Keep the trace between the device and the crystal as short as possible.
(b) Design a good ground plane around the oscillator pins.
(c) Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.
(d) Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.
(e) Use assembly materials and praxis to avoid any parasitic load on the oscillator XIN and XOUT pins.
(f) If conformal coating is used, ensure that it does not induce capacitive/resistive leakage between the oscillator pins.
(g) Do not route the XOUT line to the JTAG header to support the serial programming adapter as shown in other documentation. This
signal is no longer required for the serial programming adapter.
(2)
Includes parasitic bond and package capacitance (approximately 2 pF per pin). Because the PCB adds additional capacitance, it is
recommended to verify the correct load by measuring the ACLK frequency. For a correct setup, the effective load capacitance should
always match the specification of the used crystal.
(3)
Requires external capacitors at both terminals. Values are specified by crystal manufacturers.
(4)
Frequencies below the MIN specification set the fault flag, frequencies above the MAX specification do not set the fault flag, and
frequencies in between might set the flag.
(5)
Measured with logic-level input frequency, but also applies to operation with crystals.
Copyright
2006–2011, Texas Instruments Incorporated
33
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