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參數(shù)資料
| 型號(hào)： | MSK5820-5HRHU |
| 廠商： | MS KENNEDY CORP |
| 元件分類： | 固定正電壓?jiǎn)温份敵鯨DO穩(wěn)壓器 |
| 英文描述： | 5 V FIXED POSITIVE LDO REGULATOR, 0.4 V DROPOUT, CSFM5 |
| 封裝： | HERMETIC SEALED, SIP-5 |
| 文件頁(yè)數(shù)： | 4/8頁(yè) |
| 文件大?。?/td> | 494K |
| 代理商： | MSK5820-5HRHU |
APPLICATION NOTES CONT.
4
To select a heat sink for the MSK 5820RH, the follow-
ing formula for convective heat flow may be used.
Governing Equation:
T
J
=
P
D
X (R
θ
JC
+ R
θ
CS
+ R
θ
SA
) + T
A
Where
T
J
P
D
R
θ
JC
R
θ
CS
R
θ
SA
T
A
= Junction Temperature
= Total Power Dissipation
= Junction to Case Thermal Resistance
= Case to Heat Sink Thermal Resistance
= Heat Sink to Ambient Thermal Resistance
= Ambient Temperature
Power Dissipation=(VIN-VOUT) x I
OUT
Next, the user must select a maximum junction tem-
perature. The absolute maximum allowable junction tem-
perature is 150°C. The equation may now be rearranged
to solve for the required heat sink to ambient thermal
resistance (R
θ
SA
).
Example:
An MSK 5820-2.5RH is connected for VIN=+3.3V
and VOUT=+2.5V. I
OUT
is a continuous 3A DC level.
The ambient temperature is +25°C. The maximum de-
sired junction temperature is +125°C.
R
θ
JC
=4.0°C/W and R
θ
CS
=0.15°C/W for most thermal
greases
Power Dissipation=(3.3V-2.5V) x (3A)
=2.4 Watts
Solve for R
θ
SA:
2.4W
= 38.6°C/W
In this example, a heat sink with a thermal resistance
of no more than 38.6°C/W must be used to maintain a
junction temperature of no more than 125°C.
The MSK 5820RH control circuitry has a thermal shut-
down temperature of approximately 150°C. This ther-
mal shutdown can be used as a protection feature, but
for continuous operation, the junction temperature of the
pass transistor must be maintained below 150°C. Proper
heat sink selection is essential to maintain these condi-
tions. Exceeding the thermal limit activates the latch fea-
ture of the MSK 5820RH. Toggle the shutdown pin high
them low or cycle power to reset the latch. See shut-
down pin description and overcurrent latch description
for more information.
TYPICAL APPLICATIONS CIRCUIT
R
θ
SA
= 125°C - 25°C
FIGURE 2
THERMAL LIMITING
HEAT SINK SELECTION
Radiation performance curves for TID testing have been
generated for all radiation testing performed by MS
Kennedy. These curves show performance trends
throughout the TID test process and can be located in
the MSK 5810RH radiation test report. The complete
radiation test report is available in the RAD HARD PROD-
UCTS section on the MSK website.
TOTAL DOSE RADIATION TEST
PERFORMANCE
http://www.mskennedy.com/store.asppid=9951&catid=19680
Reference the MSK 5826RH RAD REPORT for ELDRS
and Neutron results.
Rev. G 1/11
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