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參數(shù)資料
| 型號： | MSK105 |
| 廠商： | MS KENNEDY CORP |
| 元件分類： | 運(yùn)動控制電子 |
| 英文描述： | High Power Quad Operational Amplifier(高電壓，高輸出電流四運(yùn)算放大器) |
| 中文描述： | QUAD OP-AMP, 15000 uV OFFSET-MAX, CDIP18 |
| 封裝： | CERAMIC, DIP-18 |
| 文件頁數(shù)： | 4/6頁 |
| 文件大?。?/td> | 317K |
| 代理商： | MSK105 |
APPLICATION NOTES CONTINUED
T
J
=P
D
x (R
θ
JC
+ R
θ
CS
+ R
θ
SA
) + T
A
Where
T
J
= Junction Temperature
P
D
= Total Power Dissipation
R
θ
JC
= Junction to Case Thermal Resistance
R
θ
CS
= Case to Heat Sink Thermal Resistance
R
θ
SA
= Heat Sink to Ambient Thermal Resistance
T
C
= Case Temperature
T
A
= Ambient Temperature
T
S
= Sink Temperature
Governing Equation:
Thermal Path:
HEAT SINKING
To determine if a heat sink is necessary for your appli-
cation and if so, what type, refer to the thermal model
and governing equation below.
Thermal
Model:
Example:
1.) Find Driver Power Dissipation
P
D
= [(quiescent current) x (+V
CC
- (-V
CC
))] +
[(V
CC
-V
O
) x I
OUT X
2]
= (75mA) x (40V) + (10V) x (0.5A) + (10V) x (0.5A)
= 3W + 10W
= 13W
2.) For conservative design, set T
J
=+150°C.
3.) For this example, worst case T
A
=+25°C
4.) R
θ
JC
= 4.0°C/W typically
5.) R
θ
CS
= 0.15°C/W for most thermal greases
6.) Rearrange governing equation to solve for R
θ
SA
R
θ
SA
= ((T
J
- T
A
)/P
D
) - (R
θ
JC
) - (R
θ
CS
)
= ((150°C - 25°C) / 13W) - (4°C/W) - (.15°C/W)
5.5°C/W
The heat sink in this example must have a thermal
resistance of no more than 5.5°C/W to maintain a junc-
tion temperature of no more than +150°C
.
Inside the MSK 105 package are two monolithic dual
amplifiers. For this thermal analysis, each die will be
considered individually. In our example the amplifier ap-
plication requires each output to drive a 10 volt peak
sine wave across a 20 ohm load for 0.5 amp of output
current. For a worst case analysis we will treat the 0.5
amp peak output current as a D.C. output current. The
power supplies are ±20VDC.
Rev. C 8/00
4
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