參數(shù)資料
型號(hào): MRFIC1870PP
廠商: Motorola, Inc.
英文描述: 3.2 V DCS/PCS GaAs Integrated Power Amplifier
中文描述: 3.2 V的DCS / PCS的砷化鎵集成功率放大器
文件頁(yè)數(shù): 3/4頁(yè)
文件大?。?/td> 265K
代理商: MRFIC1870PP
MOTOROLA
MRFIC1870
Product Preview
For More Information On This Product,
Go to: www.freescale.com
3
Figure 3. Outline Dimensions for QFN-20
(Case 1308-02, Issue C)
G
M
M
N
EXPOSED DIE
ATTACH PAD
2.25
1.95
16
5
1
20
2.25
1.95
20X
0.30
0.18
15
11
10
6
0.5
M
0.1
C
M
0.05
C
A B
20X
0.75
0.50
C
0.1
A B
C
0.1
A B
VIEW M-M
DETAIL M
PIN 1 INDEX
16X
PIN 1
INDEX AREA
4
B
C
0.1
2X
2X
C
0.1
A
4
1.0
0.8
1.00
0.75
0.05
0.00
C
0.1
C
0.05
C
SEATING PLANE
5
DETAIL G
VIEW ROTATED 90° CLOCKWISE
(0.5)
(0.24)
(1.19)
(0.27)
0.065
0.015
20X
(45°)
4
PREFERRED CORNER CONFIGURATION
DETAIL N
0.60
0.24
0.60
0.24
4
DETAIL N
CORNER CONFIGURATION OPTION
DETAIL T
DETAIL M
PREFERRED BACKSIDE PIN 1 INDEX
DETAIL T
PREFERRED BACKSIDE PIN 1 INDEX
(90°)
2X
2X0.31
0.1
0.0
DETAIL M
BACKSIDE PIN 1 INDEX OPTION
1.1
1.0
0.475
0.425
BACKSIDE
PIN 1 INDEX
0.25
0.15
R
NOTES:
1.
2.
DIMENSIONS ARE IN MILLIMETERS.
DIMENSIONS AND TOLERANCES PER ASME
Y14.5M, 1994.
THE COMPLETE JEDEC DESIGNATOR FOR THIS PACKAGE
IS: HF-PQFP-N.
CORNER CHAMFER MAY NOT BE PRESENT. DIMENSIONS
OF OPTIONAL FEATURES ARE FOR REFERENCE ONLY.
COPLANARITY APPLIES TO LEADS, CORNER LEADS, AND
DIE ATTACH PAD.
FOR ANVIL SINGULATED QFN PACKAGES, MAXIMUM
DRAFT ANGLE IS 12°.
3.
4.
5.
7.
F
Freescale Semiconductor, Inc.
n
.
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