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參數(shù)資料
| 型號(hào)： | MRFIC0914 |
| 廠商： | MOTOROLA INC |
| 元件分類(lèi)： | 衰減器 |
| 英文描述： | 900 MHz PAGING POWER AMPLIFIER Si MONOLITHIC INTEGRATED CIRCUIT |
| 中文描述： | 890 MHz - 928 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER |
| 文件頁(yè)數(shù)： | 4/6頁(yè) |
| 文件大小： | 127K |
| 代理商： | MRFIC0914 |
MRFIC0914
4
MOTOROLA RF DEVICE DATA
30.75
30.50
30.25
30.00
0
20
40
DUTY CYCLE (%)
60
80
100
IDtotal
Pout
TA = 25
°
C
f = 900 MHz
VCNTRL = 4 V, 5 ms PULSE
VD1, VD2, VD3 = 4.8 V
Pin = 3 dBm
o
620
600
580
560
Figure 8. Output Power versus Duty Cycle
T
f
Zin (
)
ZOL* (
)
MHz
R
jX
R
jX
800
48.8
–16.3
2.56
14.3
850
49.0
–17.9
3.30
14.4
900
49.0
–19.6
2.80
13.1
950
49.4
–21.2
3.94
14.0
1000
49.8
–23.1
3.95
12.6
Table 1. Device Impedances Derived from Circuit Characterization
APPLICATIONS INFORMATION
DESIGN PHILOSOPHY
The MRFIC0914 three stage LDMOS integrated power
amplifier was designed for low cost and flexibility. While the
target application was two–way paging, the device can be
used in a variety of 800 to 1000 MHz applications and it is
particularly suited to burst mode digital transmissions with
constant envelope modulation schemes. Only one supply is
required. The VCNTRL pin allows the setting of the gate bias
of the three stages simultaneoulsy for optimum gain and effi-
ciency and serves as a transmit control with more than 60 dB
dynamic range.
CIRCUIT DETAILS
In Figure 1, the 900 MHz applications circuit, note that
each stage has a separate supply pin, including the RF Out-
put for the third stage. Care should be taken in bypassing
these supply connections to avoid low frequency oscillation.
Chip capacitors should be mounted as close to the leads and
ground vias as possible. Ground vias should be provided
close to the indicated ground leads as well. L1 is a bias
choke supplying the third stage and could be replaced with a
quarter wave line or air–wound inductor.
RF performance is sensitive to the output matching net-
work. C9 and L3 form a second harmonic trap which en-
hances efficiency. Placement of C3 along the 50
line at the
device output is critical to gain and efficiency. L2, the input
matching inductor, is optional. Without this inductor, the input
match is still typically better than 2:1 VSWR.
It should be note that Figure 1 does not portray the parasit-
ics of the chip components nor their solder mounting pads.
The board material is 18 mil dielectric thickness FR4. The im-
pedances shown in Table 1 were derived from circuit charac-
terization and are given as an aid to original designs.
EVALUATION BOARDS
Evaluation boards are available for RF Monolithic Inte-
grated Circuits by adding a “TF” to the device type. For a
complete list of currently available boards and ones in devel-
opment for newly introduced products, please consult your
local Motorola Distributor or Sales Office.
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