
MRF6VP41KHR6 MRF6VP41KHSR6
17
RF Device Data
Freescale Semiconductor
PRODUCT DOCUMENTATION AND SOFTWARE
Refer to the following documents to aid your design process.
Application Notes
AN1955: Thermal Measurement Methodology of RF Power Amplifiers
Engineering Bulletins
EB212: Using Data Sheet Impedances for RF LDMOS Devices
Software
Electromigration MTTF Calculator
RF High Power Model
For Software, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to the Software &
Tools tab on the part’s Product Summary page to download the respective tool.
REVISION HISTORY
The following table summarizes revisions to this document.
Revision
Date
Description
0
Jan. 2008
Initial Release of Data Sheet
1
Apr. 2008
Added Fig. 12, Maximum Transient Thermal Impedance, p. 6
2
Sept. 2008
Added Note to Fig. 4, Capacitance versus Drain--Source Voltage, to denote that each side of device is
measured separately, p. 5
Updated Fig. 5, DC Safe Operating Area, to clarify that measurement is on a per--side basis, p. 5
Corrected Fig. 13, MTTF versus Junction Temperature, to reflect the correct die size and increased the
MTTF factor accordingly, p. 6
3
Nov. 2008
Added CW operation capability bullet to Features section, p. 1
Added CW operation to Maximum Ratings table, p. 1
Added CW thermal data to Thermal Characteristics table, p. 2
Fig. 14, Series Equivalent Source and Load Impedance, corrected Zsource copy to read “Test circuit
impedance as measured from gate to gate, balanced configuration” and Zload copy to read “Test circuit
impedance as measured from drain to drain, balanced configuration”; replaced impedance diagram to show
push--pull test conditions, p. 7
4
Mar. 2009
CW rating limits updated from 1176 W to 1107 W and 5.5 W/°Cto4.6 W/°C to reflect recent remeasured
data, Max Ratings table, p. 1
CW Thermal Characteristics changed from 81°Cto48°C and 0.16 °C/W to 0.15 °C/W using data from the
most recent 352.2 MHz CW application circuit, p. 2
Added Typical Performances table for 352.2 MHz and 500 MHz applications, p. 3
Added Fig. 14, MTTF versus Junction Temperature -- CW, p. 7
Added Figs. 16 and 18, Test Circuit Component Layout -- 352.2 MHz and 500 MHz, and Tables 6 and 7, Test
Circuit Component Designations and Values -- 352.2 MHz and 500 MHz, p. 9, 11
Added Figs. 17 and 19, Series Equivalent Source and Load Impedance -- 352.2 MHz and 500 MHz, p. 10, 12
5
Apr. 2010
Operating Junction Temperature increased from 200°C to 225°C in Maximum Ratings table and related
“Continuous use at maximum temperature will affect MTTF” footnote added, p. 1
Added Electromigration MTTF Calculator and RF High Power Model availability to Product Software,
p. 17