參數(shù)資料
型號(hào)： MR82C55B
廠商： Harris Corporation
英文描述： CMOS Programmable Peripheral Interface
中文描述： CMOS可編程外設(shè)接口
文件頁(yè)數(shù)： 24/26頁(yè)
文件大小： 234K
代理商： MR82C55B
24
82C55A
Plastic Leaded Chip Carrier Packages (PLCC)
NOTES:
1. Controlling dimension: INCH. Converted millimeter dimensions
are not necessarily exact.
2. Dimensions and tolerancing per ANSI Y14.5M-1982.
3. Dimensions D1 and E1 do not include mold protrusions. Allow-
able mold protrusion is 0.010 inch (0.25mm) per side. Dimen-
sions D1 and E1 include mold mismatch and are measured at
the extreme material condition at the body parting line.
4. To be measured at seating plane
5. Centerline to be determined where center leads exit plastic body.
6. “N” is the number of terminal positions.
contact point.
-C-
A1
A
SEATING
PLANE
0.020 (0.51)
MIN
VIEW “A”
D2/E2
0.025 (0.64)
0.042 (1.07)
0.056 (1.42)
0.050 (1.27) TP
E
E1
0.042 (1.07)
0.048 (1.22)
PIN (1) IDENTIFIER
C
D1
D
0.020 (0.51) MAX
3 PLCS
0.026 (0.66)
0.032 (0.81)
0.045 (1.14)
MIN
0.013 (0.33)
0.021 (0.53)
0.025 (0.64)
MIN
VIEW “A” TYP.
0.004 (0.10)
C
-C-
D2/E2
C
N44.65
(JEDEC MS-018AC ISSUE A)
44 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE
SYM-
BOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.165
0.180
4.20
4.57
-
A1
0.090
0.120
2.29
3.04
-
D
0.685
0.695
17.40
17.65
-
D1
0.650
0.656
16.51
16.66
3
D2
0.291
0.319
7.40
8.10
4, 5
E
0.685
0.695
17.40
17.65
-
E1
0.650
0.656
16.51
16.66
3
E2
0.291
0.319
7.40
8.10
4, 5
N
44
44
6
Rev. 2 11/97
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