參數(shù)資料
型號(hào)： MR760
廠商： MOTOROLA INC
元件分類： 參考電壓二極管
英文描述： HIGH CURRENT LEAD MOUNTED SILICON RECTIFIERS 50-1000 VOLTS DIFFUSED JUNCTION
中文描述： 6 A, 1000 V, SILICON, RECTIFIER DIODE
文件頁數(shù)： 3/6頁
文件大?。?/td> 188K
代理商： MR760
3
Rectifier Device Data
Figure 5. Maximum Current Ratings
TL, LEAD TEMPERATURE (
°
C)
0
8.0
I
0
12
20
28
40
80
120
160
200
Figure 6. Maximum Current Ratings
0
8.0
4.0
0
16
24
32
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
Figure 7. Power Dissipation
P
,
5/8”
,
CAPACITANCE LOADS
I(pk) = 5 Iavg
8.0
12
16
RESISTIVE INDUCTIVE
LOADS
TA, AMBIENT TEMPERATURE (
°
C)
0
1.0
I
0
2.0
3.0
4.0
40
80
120
160
200
Figure 8. Steady State Thermal Resistance
f = 60 Hz
,
RESISTIVE INDUCTIVE LOADS
CAPACITANCE LOADS – 1
& 3
20
6
1 & 3
20 Iavg
TA(A)
TA(K)
TL(A)
TC(A)
TJ
TC(K)
TL(K)
PF
R
θ
S(A)
R
θ
L(A)
R
θ
J(A)
R
θ
J (K)
R
θ
L(K)
R
θ
S(K)
Use of the above model permits junction to lead thermal resistance for
any mounting configuration to be found. Lowest values occur when one
side of the rectifier is brought as close as possible to the heat sink as
shown below. Terms in the model signify:
TA = Ambient Temperature
TL = Lead Temperature
RS = Thermal Resistance, Heat Sink to Ambient
RL = Thermal Resistance, Lead to Heat Sink
RJ = Thermal Resistance, Junction to Case
PF = Power Dissipation
(Subscripts A and K refer to anode and cathode sides, respectively.)
Values for thermal resistance components are:
RL = 40
°
C/W/in. Typically and 44
°
C/W/in Maximum.
RJ = 2
°
C/W typically and 4
°
C/W Maximum.
Since RJ is so low, measurements of the case temperature, TC, will be
approximately equal to junction temperature in practical lead mounted
applications. When used as a 60 Hz rectifierm the slow thermal response
holds TJ(PK) close to TJ(AVG). Therefore maximum lead temperature may
be found from: TL = 175
°
–R
θ
JL PF. PF may be found from Figure 7.
The recommended method of mounting to a P.C. board is shown on the
sketch, where R
θ
JA is approximately 25
°
C/W for a 1–1/2” x 1–1/2” copper
surface area. Values of 40
°
C/W are typical for mounting to terminal strips
or P.C. boards where available surface area is small.
TC = Case Temperature
TJ = Junction Temperature
éé
éé
éé
éé
éé
éé
éé
Board Ground Plane
24
28
32
0
1/4
5.0
0
1/2
3/4
1.0
L, LEAD LENGTH (INCHES)
R
θ
SINGLE LEAD TO HEAT SINK,
INSIGNIFICANT HEAT FLOW
THROUGH OTHER LEAD
10
15
20
25
30
35
40
24
16
4.0
20
60
100
140
180
4.0
12
20
28
1/8
3/8
5/8
7/8
J
°
BOTH LEADS TO HEAT
SINK WITH LENGTHS
AS SHOWN
3/8”
1/4”
L = 1/8”
20
60
100
140
180
5.0
6.0
7.0
I(pk) = 5 Iavg
I(pk) = 10 Iavg
I(pk) = 20 Iavg
10 Iavg
RESISTIVE – INDUCTIVE LOADS
BOTH LEADS TO HEAT
SINK, EQUAL LENGTH
6 (IPK/IAVE = 6.28)
SEE NOTE
R
θ
JA = 40
°
C/W
SEE NOTE
R
θ
JA = 25
°
C/W
NOTES
THERMAL CIRCUIT MODEL
(For Heat Conduction Through The Leads)
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