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| 型號： | MR3025 |
| 廠商： | ON SEMICONDUCTOR |
| 元件分類： | 參考電壓二極管 |
| 英文描述： | Medium-Current Silicon Rectifiers |
| 中文描述： | 25 A, 250 V, SILICON, RECTIFIER DIODE |
| 封裝： | Microde Button, 2 PIN |
| 文件頁數(shù)： | 7/8頁 |
| 文件大小： | 71K |
| 代理商： | MR3025 |
TRA2525 MR3025
http://onsemi.com
7
Button holding fixtures for use during soldering may be
of various materials. Stainless steel has a longer use life
while black anodized aluminum is less expensive and will
limit heat reflection and enhance absorption. The assembly
volume will influence the choice of materials. Fixture
dimension tolerances for locating the button must allow for
expansion during soldering as well as allowing for button
clearance.
Heating Techniques
The following four heating methods have their
advantages and disadvantages depending on volume of
buttons to be soldered.
1.
Belt furnaces
readily handle large or small
volumes and are adaptable to establishment of
“on–line’’ assembly since a variable belt speed sets
the run rate. Individual furnace zone controls make
excellent temperature control possible.
2.
Flame Soldering
involves the directing of natural
gas flame jets at the base of a heatsink as the
heatsink is indexed to various loading–heating–
cooling–unloading positions. This is the most
economical labor method of soldering large
volumes. Flame soldering offers good temperature
control but requires sophisticated temperature
monitoring systems such as infrared.
3.
Ovens
are good for batch soldering and are
production limited. There are handling problems
because of slow cooling. Response time is load
dependent, being a function of the watt rating of the
oven and the mass of parts. Large ovens may not
give an acceptable temperature gradient. Capital
cost is low compared to belt furnaces and flame
soldering.
4.
Hot Plates
are good for soldering small quantities
of prototype devices. Temperature control is fair
with overshoot common because of the exposed
heating surface. Solder flow and positioning can be
corrected during soldering since the assembly is
exposed. Investment cost is very low.
Regardless of the heating method used, a soldering profile
giving the time–temperature relationship of the particular
method must be determined to assure proper soldering.
Profiling must be performed on a scheduled basis to
minimize
poor
soldering.
relationship will change depending on the heating method
used.
The
time–temperature
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