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      參數資料
      型號: MQSMBG20TR
      廠商: MICROSEMI CORP-SCOTTSDALE
      元件分類: TVS二極管 - 瞬態(tài)電壓抑制
      英文描述: 600 W, UNIDIRECTIONAL, SILICON, TVS DIODE, DO-215AA
      封裝: PLASTIC PACKAGE-2
      文件頁數: 1/4頁
      文件大小: 182K
      代理商: MQSMBG20TR
      SURFACE MOUNT 600 Watt
      Transient Voltage Suppressor
      WWW
      .Microse
      m
      i
      .CO
      M
      S C O T TS DALE DIVISION
      SMBJ5.0 thru SMBJ170A, CA, e3
      and SMBG5.0 thru SMBG170A, CA, e3
      SMB5.0–
      170AC,
      e3
      DESCRIPTION
      APPEARANCE
      This SMBJ5.0-170A or SMBG5.0-170A series of surface mount 600 W
      Transient Voltage Suppressors (TVSs) protects a variety of voltage-sensitive
      components from destruction or degradation. It is available in J-bend design
      (SMBJ) with the DO-214AA package for greater PC board mounting density or
      in a Gull-wing design (SMBG) in the DO-215AA for visible solder connections.
      It is also available in both unidirectional and bidirectional configurations with a
      C or CA suffix part number as well as RoHS Compliant with an e3 suffix. Their
      response time is virtually instantaneous. As a result, they can be used for
      protection from ESD or EFT per IEC61000-4-2 and IEC61000-4-4, or for
      inductive switching environments and induced RF protection. They can also
      protect from secondary lightning effects per IEC61000-4-5 and class levels
      defined herein. Microsemi also offers numerous other TVS products to meet
      higher and lower power demands and special applications.
      NOTE: All SMB series are
      equivalent to prior SMS package
      identifications.
      IMPORTANT:
      For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
      FEATURES
      APPLICATIONS / BENEFITS
      Available in both unidirectional and bidirectional
      construction (add C or CA suffix for bidirectional)
      Selections for 5.0 to 170 volts standoff voltages (VWM)
      Optional 100% screening for avionics grade is available
      by adding MA prefix to part number for 100% temperature
      cycle -55
      oC to +125oC (10X) as well as surge (3X) and 24
      hours HTRB with post test VZ & IR (in operating direction
      for unidirectional or both directions for bidirectional)
      Options for screening in accordance with MIL-PRF-19500
      for JAN, JANTX, and JANTXV by adding MQ, MX, or MV
      prefixes respectively to part numbers.
      Axial-lead equivalent packages for thru-hole mounting
      available as P6KE6.8 to P6KE200CA (consult factory for
      other surface mount options)
      Moisture classification is Level 1 with no dry pack required
      per IPC/JEDEC J-STD-020B
      RoHS compliant devices available by adding an “e3” suffix
      Economical surface mount design in both J-bend or
      Gull-wing terminations
      Protects sensitive components such as IC’s, CMOS,
      Bipolar, BiCMOS, ECL, DTL, T
      2L, etc.
      Protection from switching transients & induced RF
      Compliant to IEC61000-4-2 and IEC61000-4-4 for
      ESD and EFT protection respectively
      Secondary lightning protection per IEC61000-4-5 with
      42 Ohms source impedance:
      Class 1: SMB 5.0 to SMB 120A or CA
      Class 2: SMB 5.0 to SMB 60A or CA
      Class 3: SMB 5.0 to SMB 30A or CA
      Class 4: SMB 5.0 to SMB 15A or CA
      Secondary lightning protection per IEC61000-4-5 with
      12 Ohms source impedance:
      Class 1: SMB 5.0 to SMB 36A or CA
      Class 2: SMB 5.0 to SMB 18A or CA
      MAXIMUM RATINGS
      MECHANICAL AND PACKAGING
      Peak Pulse Power dissipation at 25C: 600 watts at
      10/1000 μs (also see Fig 1,2, and 3).
      Impulse repetition rate (duty factor): 0.01%
      tclamping (0 volts to V(BR) min.): < 100 ps theoretical for
      unidirectional and < 5 ns for bidirectional
      Operating and Storage temperature: -65C to +150C
      Thermal resistance: 25 C/W junction to lead, or 90C/W
      junction to ambient when mounted on FR4 PC board (1oz
      Cu) with recommended footprint (see last page)
      Steady-State Power dissipation: 5 watts at TL = 25oC, or
      1.38 watts at TA = 25
      C when mounted on FR4 PC board
      with recommended footprint
      Forward Surge at 25C: 100 Amps peak impulse of 8.3
      ms half-sine wave (unidirectional only)
      Solder temperatures: 260 C for 10 s (maximum)
      CASE: Void-free transfer molded thermosetting
      epoxy body meeting UL94V-0
      TERMINALS: Gull-wing or C-bend (modified J-bend)
      tin-lead or RoHS compliant annealed matte-tin plating
      solderable per MIL-STD-750, method 2026
      POLARITY: Cathode indicated by band. No marking
      on bi-directional devices
      MARKING: Part number without standard prefix (e.g.
      5.0, 5.0A, 5.0CA, 5.0Ae3, 36, MX36A, 36CAe3, etc.)
      TAPE & REEL option: Standard per EIA-481-1-A with
      12 mm tape, 750 per 7 inch reel or 2500 per 13 inch
      reel (add “TR” suffix to part number)
      WEIGHT: 0.1 grams
      See package dimension on last page
      Microsemi
      Scottsdale Division
      Page 1
      Copyright
      2007
      6-20-2007 REV H
      8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
      相關PDF資料
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