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參數(shù)資料
| 型號： | MPXV7002DP |
| 廠商： | 飛思卡爾半導(dǎo)體(中國)有限公司 |
| 英文描述： | Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated |
| 中文描述： | 集成硅壓力傳感器的片上信號空調(diào)，溫度補償和校準(zhǔn) |
| 文件頁數(shù)： | 3/10頁 |
| 文件大?。?/td> | 333K |
| 代理商： | MPXV7002DP |
MPXV7002
Sensors
Freescale Semiconductor
3
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
The performance over temperature is achieved by
integrating the shear-stress strain gauge, temperature
compensation, calibration and signal conditioning circuitry
onto a single monolithic chip.
Figure 2
illustrates the Differential or Gauge configuration
in the basic chip carrier (Case 482). A gel die coat isolates the
die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the sensor
diaphragm.
The MPXV7002 series pressure sensor operating
characteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effects on sensor
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
Figure 3
shows the recommended decoupling circuit for
interfacing the integrated sensor to the A/D input of a
microprocessor or microcontroller. Proper decoupling of the
power supply is recommended.
Figure 4
shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
10
°
to 60
°
C using the decoupling circuit shown in
Figure 3
.
The output will saturate outside of the specified pressure
range.
Figure 2. Cross-Sectional Diagram SOP
(not to scale)
Figure 3. Recommended Power Supply Decoupling
and Output Filtering
(For additional output filtering, please refer to
Application Note AN1646.)
Figure 4. Output versus Pressure Differential
Fluoro Silicone
Gel Die Coat
Wire Bond
Die
P1
Stainless
Steel Cap
Thermoplastic
Case
Die Bond
Differential Sensing
Element
P2
+5 V
1.0
μ
F
0.01
μ
F
470 pF
GND
V
s
V
out
IPS
OUTPUT
Lead
Frame
Differential Pressure (kPa)
O
5.0
4.0
3.0
2.0
1.0
0
0
2
TYPICAL
MIN
-2
-1
1
Transfer Function:
V
out
= V
S
×
(0.2
×
P(kPa)+0.5) ± 6.25% V
FSS
V
S
= 5.0 Vdc
T
A
= 10 to 60°C
MAX
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MPXV7002GC6T1 | Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated |
| MPXV7002GC6U | Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated |
| MC9S12DP256CCFU | device made up of standard HCS12 blocks and the HCS12 processor core |
| MC9S12DP256CMPV | device made up of standard HCS12 blocks and the HCS12 processor core |
| MC9S12DJ256CFU | Microcontroller Unit (MCU) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPXV7002DP | 制造商:Freescale Semiconductor 功能描述:IC PRESSURE SENSOR -2 TO 2KPA 1351-01 制造商:Freescale Semiconductor 功能描述:IC, PRESSURE SENSOR, -2 TO 2KPA, 1351-01 |
| MPXV7002DPT1 | 功能描述:板上安裝壓力/力傳感器 SOP DUAL 2KPA RoHS:否 制造商:Honeywell 工作壓力:0 bar to 4 bar 壓力類型:Gage 準(zhǔn)確性:+ / - 0.25 % 輸出類型:Digital 安裝風(fēng)格:Through Hole 工作電源電壓:5 V 封裝 / 箱體:SIP 端口類型:Dual Radial Barbed, Same sides |
| MPXV7002G | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated |
| MPXV7002GC6T1 | 功能描述:板上安裝壓力/力傳感器 Integrated Silicon Pressure Sensor RoHS:否 制造商:Honeywell 工作壓力:0 bar to 4 bar 壓力類型:Gage 準(zhǔn)確性:+ / - 0.25 % 輸出類型:Digital 安裝風(fēng)格:Through Hole 工作電源電壓:5 V 封裝 / 箱體:SIP 端口類型:Dual Radial Barbed, Same sides |
| MPXV7002GC6U | 功能描述:板上安裝壓力/力傳感器 Integrated Silicon Pressure Sensor RoHS:否 制造商:Honeywell 工作壓力:0 bar to 4 bar 壓力類型:Gage 準(zhǔn)確性:+ / - 0.25 % 輸出類型:Digital 安裝風(fēng)格:Through Hole 工作電源電壓:5 V 封裝 / 箱體:SIP 端口類型:Dual Radial Barbed, Same sides |
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