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參數(shù)資料
| 型號： | MPXV7002 |
| 廠商： | 飛思卡爾半導(dǎo)體(中國)有限公司 |
| 英文描述： | Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated |
| 中文描述： | 集成硅壓力傳感器的片上信號空調(diào)，溫度補償和校準(zhǔn) |
| 文件頁數(shù)： | 4/10頁 |
| 文件大?。?/td> | 333K |
| 代理商： | MPXV7002 |
MPXV7002
Sensors
4
Freescale Semiconductor
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing a gel die coat which
protects the die from harsh media.
The Pressure (P1) side may be identified by using the
table below:
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
Figure 5. Small Outline Package Footprint
Part Number
Case Type
Pressure (P1)
Side Identifier
MPXV7002GC6U/GC6T1
482A-01
Vertical Port Attached
MPXV7002GP
1369-01
Side with Port Attached
MPXV7002DP
1351-01
Side with Dual Port Attached
0.660
16.76
0.060 TYP 8X
1.52
0.100 TYP 8X
2.54
0.100 TYP 8X
2.54
0.300
7.62
inch
mm
SCALE 2:1
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PDF描述 |
|---|---|
| MPXV7002DP | Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated |
| MPXV7002GC6T1 | Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated |
| MPXV7002GC6U | Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated |
| MC9S12DP256CCFU | device made up of standard HCS12 blocks and the HCS12 processor core |
| MC9S12DP256CMPV | device made up of standard HCS12 blocks and the HCS12 processor core |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPXV7002_08 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated |
| MPXV7002_09 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Silicon Pressure Sensor On-Chip Signal Conditioned Temperature Compensated and Calibrated |
| MPXV7002DP | 功能描述:板上安裝壓力/力傳感器 SOP DUAL 2KPA RoHS:否 制造商:Honeywell 工作壓力:0 bar to 4 bar 壓力類型:Gage 準(zhǔn)確性:+ / - 0.25 % 輸出類型:Digital 安裝風(fēng)格:Through Hole 工作電源電壓:5 V 封裝 / 箱體:SIP 端口類型:Dual Radial Barbed, Same sides |
| MPXV7002DP | 制造商:Freescale Semiconductor 功能描述:IC PRESSURE SENSOR -2 TO 2KPA 1351-01 制造商:Freescale Semiconductor 功能描述:IC, PRESSURE SENSOR, -2 TO 2KPA, 1351-01 |
| MPXV7002DPT1 | 功能描述:板上安裝壓力/力傳感器 SOP DUAL 2KPA RoHS:否 制造商:Honeywell 工作壓力:0 bar to 4 bar 壓力類型:Gage 準(zhǔn)確性:+ / - 0.25 % 輸出類型:Digital 安裝風(fēng)格:Through Hole 工作電源電壓:5 V 封裝 / 箱體:SIP 端口類型:Dual Radial Barbed, Same sides |
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