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參數(shù)資料
| 型號(hào)： | MPM22CGB750B |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 750 MHz, MICROPROCESSOR, XMA |
| 封裝： | MMC-2 |
| 文件頁數(shù)： | 1/68頁 |
| 文件大?。?/td> | 966K |
| 代理商： | MPM22CGB750B |
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Pentium III Processor Mobile Module:
Mobile Module Connector 2 (MMC-2)
Featuring Intel SpeedStep
Technology
Datasheet
Product Features
s
Mobile Pentium III processor featuring
Intel SpeedStep technology with processor
speeds of 850/700 MHz, 800/650 MHz,
750/600 MHz, 700/550 MHz, 650/500
MHz, and 600/500 MHz
s
On-die, primary 16-K Instruction cache and
16-K Write Back Data cache
s
On-die, 256-K L2 cache
— Eight-way set associative
— Runs at the speed of the processor core
s
Fully compatible with previous Intel
mobile microprocessors
— Binary compatible with all applications
— Support for MMX
technology
s
Supports streaming SIMD
s
Power management features that provide
low-power dissipation
— Quick Start mode
— Deep Sleep mode
s
Integrated math co-processor
s
Integrated active thermal feedback (ATF)
system
s
Programmable trip point interrupt or poll
mode for temperature reading
s
Intel 82443BX Host Bridge system
controller
— DRAM controller supports 3.3-V
SDRAM at 100 MHz
— Supports PCI CLKRUN# protocol
— SDRAM clock enable support and self-
refresh of SDRAM during Suspend
mode
— PCI bus control 3.3V only, PCI
Specification, Revision 2.1 compliant
s
Supports single AGP 66-MHz, 3.3-V
device
s
Two-piece thermal transfer plate (TTP) for
heat dissipation
— The CPU TTP is made of nickel-plated
copper
— The BX TTP is made of aluminum
s
Mobile Pentium III processor core voltage
regulation supports input voltages from
7.5V to 21.0V DC
— Above 80% peak efficiency
— Integrated VR solution
243356-006
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