- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄383632 > mPD784031 (NEC Corp.) 16/8-BIT SINGLE-CHIP MICROCONTROLLER PDF資料下載
參數(shù)資料
| 型號(hào)： | mPD784031 |
| 廠商： | NEC Corp. |
| 英文描述： | 16/8-BIT SINGLE-CHIP MICROCONTROLLER |
| 中文描述： | 16/8-BIT單片機(jī) |
| 文件頁(yè)數(shù)： | 80/90頁(yè) |
| 文件大?。?/td> | 377K |
| 代理商： | MPD784031 |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)當(dāng)前第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)
μ
PD784031
80
16. RECOMMENDED SOLDERING CONDITIONS
The conditions listed below shall be met when soldering the
μ
PD784031.
For details of the recommended soldering conditions, refer to our document
Semiconductor Device Mounting
Technology Manual
(C10535E)
.
Please consult with our sales offices in case any other soldering process is used, or in case soldering is done under
different conditions.
Table 16-1. Soldering Conditions for Surface-Mount Devices (1/2)
(1)
μ
PD784031GC-3B9: 80-pin plastic QFP (14
×
14
×
2.7 mm)
Caution Do not apply two or more different soldering methods to one chip (except for partial heating
method for terminal sections).
(2)
μ
PD784031GC-8BT: 80-pin plastic QFP (14
×
14
×
1.4 mm)
Caution Do not apply two or more different soldering methods to one chip (except for partial heating
method for terminal sections).
Soldering process
Soldering conditions
Symbol
Infrared ray reflow
Peak package's surface temperature: 235
°
C
Reflow time: 30 seconds or less (210
°
C or more)
Maximum allowable number of reflow processes: 2
IR35-00-2
VPS
Peak package's surface temperature: 215
°
C
Reflow time: 40 seconds or less (200
°
C or more)
Maximum allowable number of reflow processes: 2
VP15-00-2
Wave soldering
Solder temperature: 260
°
C or less
Flow time: 10 seconds or less
Number of flow processes: 1
Preheating temperature
WS60-00-1
:
120
°
C max.
(measured on the package surface)
Partial heating method
Terminal temperature: 300
°
C or less
Heat time: 3 seconds or less (for one side of a device)
-
Soldering process
Soldering conditions
Symbol
Infrared ray reflow
Peak package's surface temperature: 235
°
C
Reflow time: 30 seconds or less (210
°
C or more)
Maximum allowable number of reflow processes: 3
IR35-00-3
VPS
Peak package's surface temperature: 215
°
C
Reflow time: 40 seconds or less (200
°
C or more)
Maximum allowable number of reflow processes: 3
VP15-00-3
Wave soldering
Solder temperature: 260
°
C or less
Flow time: 10 seconds or less
Number of flow processes: 1
Preheating temperature
WS60-00-1
:
120
°
C max.
(measured on the package surface)
Partial heating method
Terminal temperature: 300
°
C or less
Heat time: 3 seconds or less (for one side of a device)
-
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| mPD784035 | 16/8-BIT SINGLE-CHIP MICROCONTROLLER |
| mPD784036 | 16/8-BIT SINGLE-CHIP MICROCONTROLLER |
| mPD784038 | 16/8-BIT SINGLE-CHIP MICROCONTROLLER |
| mPD789104A | 8-Bit Single-Chip Microcontrollers |
| mPD789436GK-9ET | RECTIFIER STANDARD SINGLE 1.5A 50V 50 50A-ifsm 5uA-ir 1.1V-vf DO-15 4K/REEL-13 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPD784035 | 制造商:NEC 制造商全稱:NEC 功能描述:16/8-BIT SINGLE-CHIP MICROCONTROLLER |
| MPD784036 | 制造商:NEC 制造商全稱:NEC 功能描述:16/8-BIT SINGLE-CHIP MICROCONTROLLER |
| MPD784037 | 制造商:NEC 制造商全稱:NEC 功能描述:16/8-BIT SINGLE-CHIP MICROCONTROLLER |
| MPD784038 | 制造商:NEC 制造商全稱:NEC 功能描述:16/8-BIT SINGLE-CHIP MICROCONTROLLER |
| MPD789026 | 制造商:NEC 制造商全稱:NEC 功能描述:8-Bit Single-Chip Microcontrollers |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。