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參數(shù)資料
| 型號(hào)： | MPC9109 |
| 廠商： | Motorola, Inc. |
| 英文描述： | LOW VOLTAGE 1:18 CLOCK DISTRIBUTION CHIP |
| 中文描述： | 低壓1:18時(shí)鐘分配芯片 |
| 文件頁數(shù)： | 6/8頁 |
| 文件大?。?/td> | 250K |
| 代理商： | MPC9109 |
MPC9109
MOTOROLA
ECLinPS and ECLinPS Lite
DL140 — Rev 3
OUTLINE DIMENSIONS
FA SUFFIX
QFP PACKAGE
CASE 873A–02
ISSUE A
éé
éé
éé
J
DETAIL Y
A
S1
V
B
1
8
9
17
25
32
AE
AE
P
DETAIL Y
BASE
METAL
N
D
F
SECTION AE–AE
G
SPLANE
R
Q
W
K
X
0
G
E
C
H
DETAIL AD
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUM PLANE –AB–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.520 (0.020).
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER MAY VARY
FROM DEPICTION.
DIM
A
A1
MIN
7.000 BSC
3.500 BSC
MAX
MIN
0.276 BSC
0.138 BSC
MAX
INCHES
MILLIMETERS
B
B1
7.000 BSC
3.500 BSC
0.276 BSC
0.138 BSC
C
D
E
F
G
H
J
K
M
N
P
Q
R
S
S1
1.400
0.300
1.350
0.300
0.800 BSC
0.050
0.090
0.500
12 REF
0.090
0.400 BSC
1
0.150
9.000 BSC
4.500 BSC
1.600
0.450
1.450
0.400
0.055
0.012
0.053
0.012
0.031 BSC
0.002
0.004
0.020
12 REF
0.004
0.016 BSC
1
0.006
0.354 BSC
0.177 BSC
0.063
0.018
0.057
0.016
0.150
0.200
0.700
0.006
0.008
0.028
0.160
0.006
5
5
0.250
0.010
V
V1
W
X
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
DETAIL AD
A1
B1
V1
4X
S
4X
9
–T–
–Z–
–U–
T–U
0.20 (0.008)
Z
AC
T–U
0.20 (0.008)
Z
AB
0.10 (0.004) AC
–AC–
–AB–
M
8X
–
T
M
0
Z
A
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.
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