參數(shù)資料
型號: MPC875CZT66
廠商: Freescale Semiconductor
文件頁數(shù): 4/84頁
文件大小: 0K
描述: IC MPU POWERQUICC 66MHZ 256PBGA
標(biāo)準(zhǔn)包裝: 60
系列: MPC8xx
處理器類型: 32-位 MPC8xx PowerQUICC
速度: 66MHz
電壓: 3.3V
安裝類型: 表面貼裝
封裝/外殼: 256-BGA
供應(yīng)商設(shè)備封裝: 256-PBGA(23x23)
包裝: 托盤
MPC875/MPC870 PowerQUICC Hardware Specifications, Rev. 4
12
Freescale Semiconductor
Thermal Calculation and Measurement
7
Thermal Calculation and Measurement
For the following discussions, PD = (VDDL × IDDL) + PI/O, where PI/O is the power dissipation of the I/O
drivers.
NOTE
The VDDSYN power dissipation is negligible.
7.1
Estimation with Junction-to-Ambient Thermal Resistance
An estimation of the chip junction temperature, TJ, in
°C can be obtained from the following equation:
TJ = TA + (RθJA × PD)
where:
TA = ambient temperature (°C)
RθJA = package junction-to-ambient thermal resistance (°C/W)
PD = power dissipation in package
The junction-to-ambient thermal resistance is an industry standard value that provides a quick and easy
estimation of thermal performance. However, the answer is only an estimate; test cases have demonstrated
that errors of a factor of two (in the quantity TJ – TA) are possible.
Output high voltage, IOH = –2.0 mA, VDDH = 3.0 V (except XTAL and
open-drain pins)
VOH
2.4
V
Output low voltage
IOL = 2.0 mA (CLKOUT)
IOL = 3.2 mA
5
IOL = 5.3 mA
6
IOL = 7.0 mA (TXD1/PA14, TXD2/PA12)
IOL = 8.9 mA (TS, TA, TEA, BI, BB, HRESET, SRESET)
VOL
—0.5
V
1 The difference between V
DDL and VDDSYN cannot be more than 100 mV.
2 The signals PA[0:15], PB[14:31], PC[4:15], PD[3:15], PE(14:31), TDI, TDO, TCK, TRST, TMS, MII1_TXEN, and MII_MDIO are
5-V tolerant. The minimum voltage is still 2.0 V.
3 V
IL(max) for the I
2C interface is 0.8 V rather than the 1.5 V as specified in the I2C standard.
4 Input capacitance is periodically sampled.
5 A(0:31), TSIZ0/REG, TSIZ1, D(0:31), IRQ(2:4), IRQ6, RD/WR, BURST, IP_B(0:1), PA(0:4), PA(6:7), PA(10:11), PA15, PB19,
PB(23:31), PC(6:7), PC(10:13), PC15, PD8, PE(14:31), MII1_CRS, MII_MDIO, MII1_TXEN, and MII1_COL.
6 BDIP/GPL_B(5), BR, BG, FRZ/IRQ6, CS(0:7), WE(0:3), BS_A(0:3), GPL_A0/GPL_B0, OE/GPL_A1/GPL_B1,
GPL_A(2:3)/GPL_B(2:3)/CS(2:3), UPWAITA/GPL_A4, UPWAITB/GPL_B4, GPL_A5, ALE_A, CE1_A, CE2_A, OP(0:3), and
BADDR(28:30).
Table 6. DC Electrical Specifications (continued)
Characteristic
Symbol
Min
Max
Unit
相關(guān)PDF資料
PDF描述
IDT70V24S35J8 IC SRAM 64KBIT 35NS 84PLCC
IDT70V24S25J8 IC SRAM 64KBIT 25NS 84PLCC
MPC8321EZQAFDC IC MPU PWRQUICC II 516-PBGA
MPC8321EVRAFDC IC MPU PWRQUICC II 516-PBGA
IDT70V24S20J8 IC SRAM 64KBIT 20NS 84PLCC
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC875VR133 功能描述:微處理器 - MPU 133 MHz 176 MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC875VR66 功能描述:微處理器 - MPU 66 MHz 87 MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC875VR80 功能描述:微處理器 - MPU PQ I HIP6W DUET RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC875ZT133 功能描述:微處理器 - MPU PQ I HIP6W DUET RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC875ZT66 功能描述:微處理器 - MPU PQ I HIP6W DUET RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324