參數(shù)資料
型號(hào): MPC875CVR66
廠商: Freescale Semiconductor
文件頁(yè)數(shù): 79/84頁(yè)
文件大小: 0K
描述: IC MPU POWERQUICC 66MHZ 256PBGA
標(biāo)準(zhǔn)包裝: 60
系列: MPC8xx
處理器類(lèi)型: 32-位 MPC8xx PowerQUICC
速度: 66MHz
電壓: 3.3V
安裝類(lèi)型: 表面貼裝
封裝/外殼: 256-BGA
供應(yīng)商設(shè)備封裝: 256-PBGA(23x23)
包裝: 托盤(pán)
MPC875/MPC870 PowerQUICC Hardware Specifications, Rev. 4
80
Freescale Semiconductor
Document Revision History
17 Document Revision History
Table 37 lists significant changes between revisions of this hardware specification.
Table 37. Document Revision History
Revision
Number
Date
Changes
0
2/2003
Initial release.
0.1
3/2003
Took out the time-slot assigner and changed the SCC for SCC3 to SCC4.
0.2
5/2003
Changed the package drawing, removed all references to Data Parity. Changed the SPI Master Timing
Specs. 162 and 164. Added the RMII and USB timing. Added the 80-MHz timing.
0.3
5/2003
Made sure the pin types were correct. Changed the Features list to agree with the MPC885.
0.4
5/2003
Corrected the signals that had overlines on them. Made corrections on two pins that were typos.
0.5
5/2003
Changed the pin descriptions for PD8 and PD9.
0.6
5/2003
Changed a few typos. Put back the I2C. Put in the new reset configuration, corrected the USB timing.
0.7
6/2003
Changed the pin descriptions per the June 22 spec, removed Utopia from the pin descriptions,
changed PADIR, PBDIR, PCDIR and PDDIR to be 0 in the Mandatory Reset Config.
0.8
8/2003
Added the reference to USB 2.0 to the Features list and removed 1.1 from USB on the block diagrams.
0.9
8/2003
Changed the USB description to full-/low-speed compatible.
1.0
9/2003
Added the DSP information in the Features list.
Put a new sentence under Mechanical Dimensions.
Fixed table formatting.
Nontechnical edits.
Released to the external web.
1.1
10/2003
Added TDMb to the MPC875 Features list, the MPC875 Block Diagram, added 13.5 Serial Interface
AC Electrical Specifications, and removed TDMa from the pin descriptions.
2.0
12/2003
Changed DBGC in the Mandatory Reset Configuration to X1.
Changed the maximum operating frequency to 133 MHz.
Put the timing in the 80 MHz column.
Put in the orderable part numbers.
Rounded the timings to hundredths in the 80 MHz column.
Put the pin numbers in footnotes by the maximum currents in Table 6.
Changed 22 and 41 in the Timing.
Put TBD in the Thermal table.
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MPC875CZT133 功能描述:微處理器 - MPU PQ I HIP6W DUET RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC875CZT66 功能描述:微處理器 - MPU PQ I HIP6W DUET RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC875VR133 功能描述:微處理器 - MPU 133 MHz 176 MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC875VR66 功能描述:微處理器 - MPU 66 MHz 87 MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC875VR80 功能描述:微處理器 - MPU PQ I HIP6W DUET RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324