參數(shù)資料
型號(hào): MPC860DECZQ66D4
廠商: Freescale Semiconductor
文件頁(yè)數(shù): 34/78頁(yè)
文件大小: 0K
描述: IC MPU PWRQUICC 66MHZ 357-PBGA
標(biāo)準(zhǔn)包裝: 44
系列: MPC8xx
處理器類(lèi)型: 32-位 MPC8xx PowerQUICC
速度: 66MHz
電壓: 3.3V
安裝類(lèi)型: 表面貼裝
封裝/外殼: 357-BBGA
供應(yīng)商設(shè)備封裝: 357-PBGA(25x25)
包裝: 托盤(pán)
MPC860 PowerQUICC Family Hardware Specifications, Rev. 9
4
Freescale Semiconductor
Features
System integration unit (SIU)
— Bus monitor
— Software watchdog
— Periodic interrupt timer (PIT)
— Low-power stop mode
— Clock synthesizer
— Decrementer, time base, and real-time clock (RTC)
— Reset controller
— IEEE 1149.1 Std. test access port (JTAG)
Interrupts
— Seven external interrupt request (IRQ) lines
— 12 port pins with interrupt capability
— 23 internal interrupt sources
— Programmable priority between SCCs
— Programmable highest priority request
10/100 Mbps Ethernet support, fully compliant with the IEEE 802.3u Standard (not available
when using ATM over UTOPIA interface)
ATM support compliant with ATM forum UNI 4.0 specification
— Cell processing up to 50–70 Mbps at 50-MHz system clock
— Cell multiplexing/demultiplexing
— Support of AAL5 and AAL0 protocols on a per-VC basis. AAL0 support enables OAM and
software implementation of other protocols.
— ATM pace control (APC) scheduler, providing direct support for constant bit rate (CBR) and
unspecified bit rate (UBR) and providing control mechanisms enabling software support of
available bit rate (ABR)
— Physical interface support for UTOPIA (10/100-Mbps is not supported with this interface) and
byte-aligned serial (for example, T1/E1/ADSL)
— UTOPIA-mode ATM supports level-1 master with cell-level handshake, multi-PHY (up to four
physical layer devices), connection to 25-, 51-, or 155-Mbps framers, and UTOPIA/system
clock ratios of 1/2 or 1/3.
— Serial-mode ATM connection supports transmission convergence (TC) function for
T1/E1/ADSL lines, cell delineation, cell payload scrambling/descrambling, automatic
idle/unassigned cell insertion/stripping, header error control (HEC) generation, checking, and
statistics.
Communications processor module (CPM)
— RISC communications processor (CP)
— Communication-specific commands (for example, GRACEFUL STOP TRANSMIT, ENTER HUNT
MODE
, and RESTART TRANSMIT)
— Supports continuous mode transmission and reception on all serial channels
相關(guān)PDF資料
PDF描述
IDT70V658S10BCG IC SRAM 2MBIT 10NS 256BGA
IDT70V7599S166BF IC SRAM 4MBIT 166MHZ 208FBGA
IDT70V7319S166BF IC SRAM 4MBIT 166MHZ 208FBGA
MPC857TCZQ80B IC MPU PWRQUICC 80MHZ 357-PBGA
IDT70V658S10BFG IC SRAM 2MBIT 10NS 208FBGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC860DEVR50D4 功能描述:微處理器 - MPU POWER QUICC-NO LEAD RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC860DEVR50D4R2 功能描述:微處理器 - MPU POWER QUICC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC860DEVR66D4 功能描述:微處理器 - MPU POWER QUICC-NO LEAD RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC860DEVR80D4 功能描述:微處理器 - MPU POWER QUICC-NO LEAD RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC860DEZQ50D4 功能描述:微處理器 - MPU POWER QUICC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324