參數(shù)資料
型號: MPC8567VTAUJJ
廠商: Freescale Semiconductor
文件頁數(shù): 54/139頁
文件大?。?/td> 0K
描述: MPU POWERQUICC III 1023-PBGA
標準包裝: 1
系列: MPC85xx
處理器類型: 32-位 MPC85xx PowerQUICC III
速度: 1.333GHz
電壓: 1.1V
安裝類型: 表面貼裝
封裝/外殼: 1023-BBGA,F(xiàn)CBGA
供應商設備封裝: 1023-FCPBGA(33x33)
包裝: 托盤
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
21
DDR and DDR2 SDRAM
6.2
DDR SDRAM AC Electrical Characteristics
This section provides the AC electrical characteristics for the DDR SDRAM interface.
6.2.1
DDR SDRAM Input AC Timing Specifications
Table 17 provides the input AC timing specifications for the DDR2 SDRAM when GVDD(typ)=1.8 V.
Table 18 provides the input AC timing specifications for the DDR SDRAM when GVDD(typ)=2.5 V.
Table 19 provides the input AC timing specifications for the DDR SDRAM interface.
Table 17. DDR2 SDRAM Input AC Timing Specifications for 1.8-V Interface
At recommended operating conditions
Parameter
Symbol
Min
Max
Unit
Notes
AC input low voltage
VIL
—MVREF – 0.25
V
AC input high voltage
VIH
MVREF + 0.25
V
Table 18. DDR SDRAM Input AC Timing Specifications for 2.5-V Interface
At recommended operating conditions.
Parameter
Symbol
Min
Max
Unit
Notes
AC input low voltage
VIL
—MVREF – 0.31
V
AC input high voltage
VIH
MVREF + 0.31
V
Table 19. DDR SDRAM Input AC Timing Specifications
At recommended operating conditions.
Parameter
Symbol
Min
Max
Unit
Notes
Controller Skew for
MDQS—MDQ/MECC/MDM
tCISKEW
ps
1, 2
533 MHz
–300
300
3
400 MHz
–365
365
333 MHz
–390
390
Note:
1. tCISKEW represents the total amount of skew consumed by the controller between MDQS[n] and any corresponding
bit that will be captured with MDQS[n]. This should be subtracted from the total timing budget.
2. The amount of skew that can be tolerated from MDQS to a corresponding MDQ signal is called tDISKEW.This can be
determined by the following equation: tDISKEW =+/-(T/4 – abs(tCISKEW)) where T is the clock period and abs(tCISKEW)
is the absolute value of tCISKEW.
3. Maximum DDR1 frequency is 400 MHz.
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