
MPC8560 Integrated Processor Hardware Specifications, Rev. 5
Freescale Semiconductor
23
Ethernet: Three-Speed, MII Management
7.2
GMII, MII, TBI, RGMII, and RTBI AC Timing Specifications
The AC timing specifications for GMII, MII, TBI, RGMII, and RTBI are presented in this section.
7.2.1
GMII AC Timing Specifications
This section describes the GMII transmit and receive AC timing specifications.
7.2.1.1
GMII Transmit AC Timing Specifications
Table 21 provides the GMII transmit AC timing specifications.
Input low voltage
VIL
–0.3
0.90
V
Input high current (VIN
1 = LV
DD)IIH
—40
μA
Input low current (VIN
1 = GND)
IIL
–600
—
μA
Note:
1. The symbol VIN, in this case, represents the LVIN symbol referenced in Table 1 and Table 2. Table 20. GMII, MII, RGMII, RTBI, and TBI DC Electrical Characteristics
Parameters
Symbol
Min
Max
Unit
Supply voltage 2.5 V
LVDD
2.37
2.63
V
Output high voltage (LVDD = Min, IOH = –1.0 mA)
VOH
2.00
LVDD + 0.3
V
Output low voltage (LVDD = Min, IOL = 1.0 mA)
VOL
GND – 0.3
0.40
V
Input high voltage
VIH
1.70
LVDD + 0.3
V
Input low voltage
VIL
–0.3
0.70
V
Input high current (VIN
1 = LV
DD)IIH
—10
μA
Input low current (VIN
1 = GND)
IIL
–15
—
μA
Note:
1. Note that the symbol VIN, in this case, represents the LVIN symbol referenced in Table 1and Table 2. Table 21. GMII Transmit AC Timing Specifications
At recommended operating conditions with LVDD of 3.3 V ± 5%, or LVDD=2.5V ± 5%.
Parameter/Condition
Symbol 1
Min
Typ
Max
Unit
GTX_CLK clock period
tGTX
—8.0
—
ns
GTX_CLK duty cycle
tGTXH/tGTX
40
—
60
%
GMII data TXD[7:0], TX_ER, TX_EN setup time
tGTKHDV
2.5
—
ns
GTX_CLK to GMII data TXD[7:0], TX_ER, TX_EN delay
tGTKHDX
3
0.5
—
5.0
ns
Table 19. GMII, MII, and TBI DC Electrical Characteristics (continued)