參數(shù)資料
型號: MPC8560PXAQFC
廠商: Freescale Semiconductor
文件頁數(shù): 27/108頁
文件大小: 0K
描述: MPU POWERQUICC III 783FCPBGA
標(biāo)準(zhǔn)包裝: 36
系列: MPC85xx
處理器類型: 32-位 MPC85xx PowerQUICC III
速度: 1.0GHz
電壓: 1.3V
安裝類型: 表面貼裝
封裝/外殼: 784-BBGA,F(xiàn)CBGA
供應(yīng)商設(shè)備封裝: 783-FCPBGA(29x29)
包裝: 托盤
MPC8560 Integrated Processor Hardware Specifications, Rev. 4.2
Freescale Semiconductor
25
Ethernet: Three-Speed, MII Management
Figure 7 shows the GMII transmit AC timing diagram.
Figure 7. GMII Transmit AC Timing Diagram
7.2.1.2
GMII Receive AC Timing Specifications
Table 22 provides the GMII receive AC timing specifications.
GTX_CLK data clock rise and fall time
tGTXR, tGTXF
2,4
——
1.0
ns
Notes:
1. The symbols used for timing specifications herein follow the pattern t(first two letters of functional block)(signal)(state)
(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tGTKHDV
symbolizes GMII transmit timing (GT) with respect to the tGTX clock reference (K) going to the high state (H) relative
to the time date input signals (D) reaching the valid state (V) to state or setup time. Also, tGTKHDX symbolizes GMII
transmit timing (GT) with respect to the tGTX clock reference (K) going to the high state (H) relative to the time date
input signals (D) going invalid (X) or hold time. Note that, in general, the clock reference symbol representation is
based on three letters representing the clock of a particular functional. For example, the subscript of tGTX represents
the GMII(G) transmit (TX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R
(rise) or F (fall).
2.Signal timings are measured at 0.7 V and 1.9 V voltage levels.
3.Guaranteed by characterization.
4.Guaranteed by design.
Table 22. GMII Receive AC Timing Specifications
At recommended operating conditions with LVDD of 3.3 V ± 5%, or LVDD=2.5V ± 5%.
Parameter/Condition
Symbol 1
Min
Typ
Max
Unit
RX_CLK clock period
tGRX
—8.0
ns
RX_CLK duty cycle
tGRXH/tGRX
40
60
ns
RXD[7:0], RX_DV, RX_ER setup time to RX_CLK
tGRDVKH
2.0
ns
RXD[7:0], RX_DV, RX_ER hold time to RX_CLK
tGRDXKH
0.5
ns
Table 21. GMII Transmit AC Timing Specifications (continued)
At recommended operating conditions with LVDD of 3.3 V ± 5%, or LVDD=2.5V ± 5%.
Parameter/Condition
Symbol 1
Min
Typ
Max
Unit
GTX_CLK
TXD[7:0]
tGTKHDX
tGTX
tGTXH
tGTXR
tGTXF
tGTKHDV
TX_EN
TX_ER
相關(guān)PDF資料
PDF描述
MPC8568EPXAQGG MPU POWERQUICC III 1023-PBGA
MPC8572ECVTAVND MPU POWERQUICC III 1023FCPBGA
MPC860SRZQ66D4R2 IC MPU PWRQUICC 66MHZ 357-PBGA
MPC862TZQ80B IC MPU PWRQUICC 80MHZ 357-PBGA
MSC7112VM800 IC DSP PROCESSOR 16BIT 400MAPBGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8560VT667LB 功能描述:微處理器 - MPU PQ 3 8560-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8560VT667LC 功能描述:微處理器 - MPU PQ 3 8560-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8560VT833LB 功能描述:微處理器 - MPU PQ 3 8560-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8560VT833LC 功能描述:微處理器 - MPU PQ 3 8560-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8560VTAQFB 功能描述:微處理器 - MPU PQ 3 8560-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324