參數(shù)資料
型號： MPC8544AVTANG
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 400 MHz, MICROPROCESSOR, PBGA783
封裝： 29 X 29 MM, 1 MM PITCH, LEAD FREE, PLASTIC, FC-PBGA-783
文件頁數(shù)： 10/128頁
文件大小： 1411K
代理商： MPC8544AVTANG
MPC8544E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
107
Thermal
Tyco Electronics
800-522-6752
Chip Coolers
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
Wakefield Engineering
603-635-2800
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost. Several
heat sinks offered by Aavid Thermalloy, Advanced Thermal Solutions, Alpha Novatech, IERC, Chip
Coolers, Millennium Electronics, and Wakefield Engineering offer different heat sink-to-ambient thermal
resistances, that will allow the MPC8544E to function in various environments.
20.3.1
Internal Package Conduction Resistance
For the packaging technology, shown in Table 71, the intrinsic internal conduction thermal resistance paths
are as follows:
The die junction-to-case thermal resistance
The die junction-to-board thermal resistance
Figure 62 depicts the primary heat transfer path for a package with an attached heat sink mounted to a
printed-circuit board.
Figure 62. Package with Heat Sink Mounted to a Printed-Circuit Board
The heat sink removes most of the heat from the device. Heat generated on the active side of the chip is
conducted through the silicon and through the heat sink attach material (or thermal interface material), and
finally to the heat sink. The junction-to-case thermal resistance is low enough that the heat sink attach
material and heat sink thermal resistance are the dominant terms.
External Resistance
Internal Resistance
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
(Note the internal versus external package resistance.)
相關PDF資料
PDF描述
MPC8544AVTAQG 32-BIT, 400 MHz, MICROPROCESSOR, PBGA783
MPC8544EAVTAQG 32-BIT, 400 MHz, MICROPROCESSOR, PBGA783
MPC8544EVTANG 32-BIT, 800 MHz, MICROPROCESSOR, PBGA783
MPC8544ECVTARJ 32-BIT, 1067 MHz, MICROPROCESSOR, PBGA783
MPC8544EVTAQG 32-BIT, 1000 MHz, MICROPROCESSOR, PBGA783
相關代理商/技術參數(shù)
參數(shù)描述
MPC8544AVTANGA 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC PQ38K 8544 RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT
MPC8544AVTAQG 功能描述:微處理器 - MPU PQ3 8544 COMMERCIAL RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8544AVTAQGA 制造商:Freescale Semiconductor 功能描述:PQ38K 8544 - Bulk
MPC8544AVTARJ 功能描述:微處理器 - MPU PQ3 8544 COMMERCIAL RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8544AVTARJA 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC PQ38K 8544 RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT
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