參數(shù)資料
型號： MPC8540CPXAQFB
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 667 MHz, MICROPROCESSOR, PBGA783
封裝： 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, FLIP CHIP, PLASTIC, BGA-783
文件頁數(shù)： 83/104頁
文件大?。?/td> 1353K
代理商： MPC8540CPXAQFB
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
8
Freescale Semiconductor
Electrical Characteristics
2.1 Overall DC Electrical Characteristics
This section covers the ratings, conditions, and other characteristics.
2.1.1 Absolute Maximum Ratings
Table 1 provides the absolute maximum ratings.
Table 1. Absolute Maximum Ratings 1
Characteristic
Symbol
Max Value
Unit
Notes
Core supply voltage
For devices rated at 667 and 833 MHz
For devices rated at 1 GHz
VDD
–0.3 to 1.32
–0.3 to 1.43
V
PLL supply voltage
For devices rated at 667 and 833 MHz
For devices rated at 1 GHz
AVDD
–0.3 to 1.32
–0.3 to 1.43
V
DDR DRAM I/O voltage
GVDD
–0.3 to 3.63
V
Three-speed Ethernet I/O voltage
LVDD
–0.3 to 3.63
–0.3 to 2.75
V
PCI/PCI-X, local bus, RapidIO, 10/100 Ethernet, MII
management, DUART, system control and power
management, I2C, and JTAG I/O voltage
OVDD
–0.3 to 3.63
V
3
Input voltage
DDR DRAM signals
MVIN
–0.3 to (GVDD + 0.3)
V
2, 5
DDR DRAM reference
MVREF
–0.3 to (GVDD + 0.3)
V
2, 5
Three-speed Ethernet signals
LVIN
–0.3 to (LVDD + 0.3)
V
4, 5
PCI/PCI-X, Local bus, RapidIO,
10/100 Ethernet, DUART,
SYSCLK, system control and
power management, I2C, and
JTAG signals
OVIN
–0.3 to (OVDD + 0.3)
V
5
Storage temperature range
TSTG
–55 to 150
C
Notes:
1.Functional and tested operating conditions are given in Table 2. Absolute maximum ratings are stress
ratings only, and functional operation at the maximums is not guaranteed. Stresses beyond those listed
may affect device reliability or cause permanent damage to the device.
2.Caution: MVIN must not exceed GVDD by more than 0.3 V. This limit may be exceeded for a maximum of
20 ms during power-on reset and power-down sequences.
3.Caution: OVIN must not exceed OVDD by more than 0.3 V. This limit may be exceeded for a maximum of 20
ms during power-on reset and power-down sequences.
4.Caution: LVIN must not exceed LVDD by more than 0.3 V. This limit may be exceeded for a maximum of 20
ms during power-on reset and power-down sequences.
5.(M,L,O)VIN and MVREF may overshoot/undershoot to a voltage and for a maximum duration as shown in
相關(guān)PDF資料
PDF描述
MPC8540CVT833JB 32-BIT, 667 MHz, MICROPROCESSOR, PBGA783
MPC8540PXALDB 32-BIT, 667 MHz, MICROPROCESSOR, PBGA783
MPC8540PXAPDB 32-BIT, 833 MHz, MICROPROCESSOR, PBGA783
MPC8540VT667LB 32-BIT, 667 MHz, MICROPROCESSOR, PBGA783
MPC8540CPX667LB 32-BIT, 667 MHz, MICROPROCESSOR, PBGA783
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參數(shù)描述
MPC8540CVT667JB 功能描述:微處理器 - MPU PQ 3 8540-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8540CVT667JC 功能描述:微處理器 - MPU PQ 3 8540-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8540PX533JB 功能描述:微處理器 - MPU PQ 3 8540-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8540PX667LB 功能描述:微處理器 - MPU PQ 3 8540-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8540PX667LC 功能描述:微處理器 - MPU PQ 3 8540-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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