MPC8536E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
Electrical Characteristics
Freescale Semiconductor
34
This figure shows the DDR2 and DDR3 SDRAM interface input timing diagram.
Figure 8. DDR SDRAM Input Timing Diagram
Table 17. DDR3 SDRAM Input AC Timing Specifications for 1.5-V Interface
At recommended operating conditions with GVDD of 1.5 V ± 5%. DDR3 data rate is between 606MHz and 667MHz.
Parameter
Symbol
Min
Max
Unit
Notes
AC input low voltage
VIL
—MVREF – 0.175
V
—
AC input high voltage
VIH
MVREF + 0.175
—
V
—
Table 18. DDR2 and DDR3 SDRAM Interface Input AC Timing Specifications
At recommended operating conditions with GVDD of 1.8 V ± 5% for DDR2 or 1.5 V ± 5% for DDR3.
Parameter
Symbol
Min
Max
Unit
Notes
Controller Skew for MDQS—MDQ/MECC
tCISKEW
—
ps
1, 2
667 MHz
—
–240
240
—
3
533 MHz
—
–300
300
—
400 MHz
—
–365
365
—
Note:
1. tCISKEW represents the total amount of skew consumed by the controller between MDQS[n] and any corresponding bit that will
be captured with MDQS[n]. This should be subtracted from the total timing budget.
2. The amount of skew that can be tolerated from MDQS to a corresponding MDQ signal is called tDISKEW.This can be determined
by the following equation: tDISKEW =+/-(T/4 - abs(tCISKEW)) where T is the clock period and abs(tCISKEW) is the absolute value
of tCISKEW.
3. Maximum DDR2 and DDR3 frequency is 667MHz.
MCK[n]
tMCK
MDQ[x]
MDQS[n]
tDISKEW
D1
D0
tDISKEW