
Electrical Characteristics
MPC8535E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
Freescale Semiconductor
105
A recovered TX UI is calculated over 3500 consecutive unit intervals of sample data. The eye diagram is created using all edges
of the 250 consecutive UI in the center of the 3500 UI used for calculating the TX UI.
NOTE
The reference impedance for return loss measurements is 50. to ground for both the D+ and
D- line (that is, as measured by a Vector Network Analyzer with 50. probes—see
Figure 71). Note that the series capacitors, CTX, are optional for the return loss
measurement.
Figure 70. Minimum Receiver Eye Timing and Voltage Compliance Specification
2.22.1
Compliance Test and Measurement Load
The AC timing and voltage parameters must be verified at the measurement point, as specified within 0.2 inches of the package
pins, into a test/measurement load shown in the following figure.
NOTE
The allowance of the measurement point to be within 0.2 inches of the package pins is
meant to acknowledge that package/board routing may benefit from D+ and D– not being
exactly matched in length at the package pin boundary.
Figure 71. Compliance Test/Measurement Load
2.23
Clocking
This section describes the PLL configuration of the chip. Note that the platform clock is identical to the core complex bus (CCB)
clock.
VRX-DIFF = 0 mV
(D+, D– Crossing Point
VRX-DIFF = 0 mV
(D+, D– Crossing Point
VRX-DIFFp-p-MIN > 175 mV
0.4 UI = TRX-EYE-MIN
TX
Silicon
+ Package
C = CTX
R = 50
Ω
R = 50
Ω
D+ Package
Pin
D– Package
Pin
D+ Package
Pin