參數(shù)資料
型號(hào)： MPC8533VTANGB
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 800 MHz, RISC PROCESSOR, PBGA783
封裝： 29 X 29 MM, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-783
文件頁數(shù)： 110/116頁
文件大?。?/td> 1277K
代理商： MPC8533VTANGB
MPC8533E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
93
Thermal
19.6.2
Platform to FIFO Restrictions
Please note the following FIFO maximum speed restrictions based on platform speed. Refer to Section 4.4,
“Platform to FIFO Restrictions,” for additional information.
20 Thermal
This section describes the thermal specifications of the MPC8533E.
20.1
Thermal Characteristics
Table 65 provides the package thermal characteristics.
Table 64. FIFO Maximum Speed Restrictions
Platform Speed (MHz)
Maximum FIFO Speed for Reference Clocks
TSEC
n_TX_CLK, TSECn_RX_CLK (MHz)1
533
126
400
94
Note:
1. FIFO speed should be less than 24% of the platform speed.
Table 65. Package Thermal Characteristics
Characteristic
JEDEC Board
Symbol
Value
Unit
Notes
Junction-to-ambient natural convection
Single layer board (1s)
RθJA
26
°C/W
1, 2
Junction-to-ambient natural convection
Four layer board (2s2p)
RθJA
21
°C/W
1, 2
Junction-to-ambient (@200 ft/min)
Single layer board (1s)
RθJA
21
°C/W
1, 2
Junction-to-ambient (@200 ft/min)
Four layer board (2s2p)
RθJA
17
°C/W
1, 2
Junction-to-board thermal
—
RθJB
12
°C/W
3
Junction-to-case thermal
—
RθJC
<0.1
°C/W
4
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
2. Per JEDEC JESD51-2 and JESD51-6 with the board (JESD51-9) horizontal.
3. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
4. Thermal resistance between the active surface of the die and the case top surface determined by the cold plate method (MIL
SPEC-883 Method 1012.1) with the calculated case temperature. Actual thermal resistance is less than 0.1
°C/W.
相關(guān)PDF資料
PDF描述
MPC8533VTAQGB 32-BIT, 1000 MHz, RISC PROCESSOR, PBGA783
MPC8533EVTARJB 32-BIT, 1067 MHz, RISC PROCESSOR, PBGA783
MPC8533VTALJB 32-BIT, 667 MHz, RISC PROCESSOR, PBGA783
MPC8533EVTANJB 32-BIT, 800 MHz, RISC PROCESSOR, PBGA783
MPC8533EVTAQJB 32-BIT, 1000 MHz, RISC PROCESSOR, PBGA783
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