參數(shù)資料
型號： MPC8533VTALJB
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 667 MHz, RISC PROCESSOR, PBGA783
封裝： 29 X 29 MM, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-783
文件頁數(shù)： 113/116頁
文件大?。?/td> 1277K
代理商： MPC8533VTALJB
MPC8533E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 2
96
Freescale Semiconductor
Thermal
20.3
Thermal Management Information
This section provides thermal management information for the flip chip plastic ball grid array (FC-PBGA)
package for air-cooled applications. Proper thermal control design is primarily dependent on the
system-level design—the heat sink, airflow, and thermal interface material. The MPC8533E implements
several features designed to assist with thermal management, including the temperature diode. The
temperature diode allows an external device to monitor the die temperature in order to detect excessive
temperature conditions and alert the system; see Section 20.3.4, “Temperature Diode,” for more
information.
The recommended attachment method to the heat sink is illustrated in Figure 57. The heat sink should be
attached to the printed-circuit board with the spring force centered over the die. This spring force should
not exceed 10 pounds force (45 Newton).
Figure 57. Package Exploded Cross-Sectional View with Several Heat Sink Options
The system board designer can choose between several types of heat sinks to place on the device. There
are several commercially-available heat sinks from the following vendors:
Aavid Thermalloy
603-224-9988
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Advanced Thermal Solutions
781-769-2800
89 Access Road #27.
Norwood, MA02062
Internet: www.qats.com
Alpha Novatech
408-567-8082
473 Sapena Ct. #12
Santa Clara, CA 95054
Internet: www.alphanovatech.com
Thermal Interface Material
Heat Sink
FC-PBGA Package
Heat Sink
Clip
Printed-Circuit Board
Die
Adhesive or
相關(guān)PDF資料
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MPC8533EVTANJB 32-BIT, 800 MHz, RISC PROCESSOR, PBGA783
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8533VTANG 功能描述:微處理器 - MPU PQ38K 8533 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8533VTANGA 功能描述:微處理器 - MPU PQ38K 8533 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8533VTAQG 功能描述:微處理器 - MPU PQ38K 8533 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8533VTAQGA 功能描述:微處理器 - MPU PQ38K 8533 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8533VTARJ 功能描述:微處理器 - MPU PQ38K 8533 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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