參數(shù)資料
型號(hào): MPC8533EVTAQG
廠(chǎng)商: Freescale Semiconductor
文件頁(yè)數(shù): 30/112頁(yè)
文件大?。?/td> 0K
描述: MPU POWERQUICC 783-PBGA
標(biāo)準(zhǔn)包裝: 36
系列: MPC85xx
處理器類(lèi)型: 32-位 MPC85xx PowerQUICC III
速度: 1.0GHz
電壓: 0.95 V ~ 1.05 V
安裝類(lèi)型: 表面貼裝
封裝/外殼: 783-BBGA,F(xiàn)CBGA
供應(yīng)商設(shè)備封裝: 783-FCPBGA(29x29)
包裝: 托盤(pán)
MPC8533E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6
24
Freescale Semiconductor
Enhanced Three-Speed Ethernet (eTSEC), MII Management
8.2
eTSEC DC Electrical Characteristics
All GMII, MII, TBI, RGMII, RTBI, RMII, and FIFO drivers and receivers comply with the DC parametric
attributes specified in Table 21 and Table 22. The potential applied to the input of a GMII, MII, TBI, RTBI,
RMII, and FIFO receiver may exceed the potential of the receiver’s power supply (that is, a GMII driver
powered from a 3.6-V supply driving VOH into a GMII receiver powered from a 2.5-V supply). Tolerance
for dissimilar GMII driver and receiver supply potentials is implicit in these specifications. The RGMII
and RTBI signals are based on a 2.5-V CMOS interface voltage as defined by JEDEC EIA/JESD8-5.
Table 21. GMII, MII, TBI, RMII and FIFO DC Electrical Characteristics
Parameter
Symbol
Min
Max
Unit
Notes
Supply voltage 3.3 V
LVDD
TVDD
3.135
3.465
V
1, 2
Output high voltage (LVDD/TVDD = Min, IOH = –4.0 mA)
VOH
2.4
V
Output low voltage (LVDD/TVDD = Min, IOL = 4.0 mA)
VOL
0.5
V
Input high voltage
VIH
1.95
V
Input low voltage
VIL
—0.90
V
Input high current (VIN = LVDD, VIN = TVDD)IIH
—40
A
1, 2, 3
Input low current (VIN = GND)
IIL
–600
A3
Notes:
1. LVDD supports eTSEC1.
2. TVDD supports eTSEC3.
3. The symbol VIN, in this case, represents the LVIN and TVIN symbols referenced in Table 1 and Table 2.
Table 22. GMII, MII, RMII, RGMII, RTBI, TBI, and FIFO DC Electrical Characteristics
Parameters
Symbol
Min
Max
Unit
Notes
Supply voltage 2.5 V
LVDD/TVDD
2.375
2.625
V
1, 2
Output high voltage (LVDD/TVDD = Min, IOH = –1.0 mA)
VOH
2.0
V
Output low voltage (LVDD/TVDD = Min, IOL = 1.0 mA)
VOL
—0.4
V
Input high voltage
VIH
1.70
V
Input low voltage
VIL
—0.7
V
Input current (VIN = 0, VIN = LVDD, VIN = TVDD)IIN
—±15
A
1, 2, 3
Notes:
1. LVDD supports eTSEC1.
2. TVDD supports eTSEC3.
3. The symbol VIN, in this case, represents the LVIN and TVIN symbols referenced in Table 1 and Table 2.
相關(guān)PDF資料
PDF描述
FMC35DRAH CONN EDGECARD 70POS R/A .100 SLD
IDT7006L25J8 IC SRAM 128KBIT 25NS 68PLCC
MPC8540VT667LC IC MPU 32BIT 667MHZ 783-FCPBGA
XF2M-4515-1A CONN FPC 45POS 0.5MM PITCH SMD
FMC26DREN-S93 CONN EDGECARD 52POS .100 EYELET
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8533EVTAQGA 功能描述:微處理器 - MPU PQ38K 8533E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8533EVTARJ 功能描述:微處理器 - MPU PQ38K 8533E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8533EVTARJA 功能描述:微處理器 - MPU PQ38K 8533E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8533VTALF 功能描述:微處理器 - MPU PQ38K 8533 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8533VTALFA 功能描述:微處理器 - MPU PQ38K 8533 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324