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參數(shù)資料
| 型號： | MPC852TZT80 |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 80 MHz, RISC PROCESSOR, PBGA256 |
| 封裝： | PLASTIC, BGA-256 |
| 文件頁數(shù)： | 4/72頁 |
| 文件大小： | 1210K |
| 代理商： | MPC852TZT80 |
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12
MPC852T Hardware Specifications
MOTOROLA
Layout Practices
11 Layout Practices
Each VDD pin on the MPC852T should be provided with a low-impedance path to the board’s supply. Each
GND pin should likewise be provided with a low-impedance path to ground. The power supply pins drive
distinct groups of logic on chip. The VDD power supply should be bypassed to ground using at least four 0.1
F by-pass capacitors located as close as possible to the four sides of the package. Each board designed
should be characterized and additional appropriate decoupling capacitors should be used if required. The
capacitor leads and associated printed circuit traces connecting to chip VDD and GND should be kept to less
than half an inch per capacitor lead. At a minimum, a four-layer board employing two inner layers as VDD
and GND planes should be used.
All output pins on the MPC852T have fast rise and fall times. Printed circuit (PC) trace interconnection
length should be minimized to minimize undershoot and reflections that these fast output switching times
cause. This recommendation particularly applies to the address and data buses. Maximum PC trace lengths
of six inches are recommended. Capacitance calculations should consider all device loads as well as
parasitic capacitances that the PC traces cause. Attention to proper PCB layout and bypassing becomes
especially critical in systems with higher capacitive loads, because these loads create higher transient
currents in the VDD and GND circuits. Pull up all unused inputs or signals that are inputs during reset.
Special care should be taken to minimize the noise levels on the PLL supply pins. For more information,
please refer to MPC866 User’s Manual, Section 14.4.3 Clock Synthesizer Power (VDDSYN, VSSSYN,
VSSSYN1).
Table 6. Mandatory Reset Configuration of MPC852T
Register/Configuration
Field
Value
(binary)
HRCW
(Hardware reset configuration word)
HRCW[DBGC]
X1
SIUMCR
(SIU module configuration register)
SIUMCR[DBGC]
X1
MBMR
(Machine B mode register)
MBMR[GPLB4DIS}
0
PAPAR
(Port A pin assignment register)
PAPAR[4-7]
PAPAR[12-15]
0
PADIR
(Port A Data Direction Register)
PADIR[4-7]
PADIR[12-15]
1
PBPAR
(Port B Pin Assignment Register)
PBPAR[14]
PBPAR[16-23]
PBPAR[26-27]
0
PBDIR
(Port B Data Direction Register)
PBDIR[14]
PBDIR[16-23]
PBDIR[26-27]
1
PCPAR
(Port C Pin Assignment Register)
PCPAR[8-11]
PCDIR[14]
0
PCDIR
(Port C Data Direction Register)
PCDIR[8-11]
PCDIR[14]
1
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| MPC852TZT80A | 功能描述:微處理器 - MPU POWER QUICC II HIP6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8533EVTALF | 功能描述:微處理器 - MPU PQ38K 8533E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8533EVTALFA | 功能描述:微處理器 - MPU PQ38K 8533E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8533EVTANG | 功能描述:微處理器 - MPU PQ38K 8533E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8533EVTANGA | 功能描述:微處理器 - MPU PQ38K 8533E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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