- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄45365 > MPC8360ZUAJDGA (FREESCALE SEMICONDUCTOR INC) 32-BIT, 533 MHz, RISC PROCESSOR, PBGA740 PDF資料下載
參數(shù)資料
| 型號： | MPC8360ZUAJDGA |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 533 MHz, RISC PROCESSOR, PBGA740 |
| 封裝： | 37.50 X 37.50 MM, 1.46 MM HEIGHT, 1 MM PITCH, TBGA-740 |
| 文件頁數(shù)： | 97/102頁 |
| 文件大?。?/td> | 606K |
| 代理商： | MPC8360ZUAJDGA |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁第88頁第89頁第90頁第91頁第92頁第93頁第94頁第95頁第96頁當(dāng)前第97頁第98頁第99頁第100頁第101頁第102頁
MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 5
94
Freescale Semiconductor
Thermal Management Information
This table shows heat sinks and junction-to-ambient thermal resistance for TBGA package.
Accurate thermal design requires thermal modeling of the application environment using computational fluid dynamics
software which can model both the conduction cooling and the convection cooling of the air moving through the application.
Simplified thermal models of the packages can be assembled using the junction-to-case and junction-to-board thermal
resistances listed in the thermal resistance table. More detailed thermal models can be made available on request.
Heat sink vendors include the following:
Aavid Thermalloy
603-224-9988
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Alpha Novatech
408-749-7601
473 Sapena Ct. #15
Santa Clara, CA 95054
Internet: www.alphanovatech.com
International Electronic Research Corporation (IERC)
818-842-7277
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Table 78. Heat Sinks and Junction-to-Ambient Thermal Resistance of TBGA Package
Heat Sink Assuming Thermal Grease
Airflow
35
× 35 mm TBGA
Junction-to-Ambient
Thermal Resistance
AAVID 30 × 30 × 9.4 mm pin fin
Natural convention
10.7
AAVID 30 × 30 × 9.4 mm pin fin
1 m/s
6.2
AAVID 30 × 30 × 9.4 mm pin fin
2 m/s
5.3
AAVID 31 × 35 × 23 mm pin fin
Natural convention
8.1
AAVID 31 × 35 × 23 mm pin fin
1 m/s
4.4
AAVID 31 × 35 × 23 mm pin fin
2 m/s
3.7
Wakefield, 53 × 53 × 25 mm pin fin
Natural convention
5.4
Wakefield, 53 × 53 × 25 mm pin fin
1 m/s
3.2
Wakefield, 53 × 53 × 25 mm pin fin
2 m/s
2.4
MEI, 75 × 85 × 12 no adjacent board, extrusion
Natural convention
6.4
MEI, 75 × 85 × 12 no adjacent board, extrusion
1 m/s
3.8
MEI, 75 × 85 × 12 no adjacent board, extrusion
2 m/s
2.5
MEI, 75 × 85 × 12 mm, adjacent board, 40 mm side bypass
1 m/s
2.8
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MPC8360ZUALDHA | 32-BIT, 667 MHz, RISC PROCESSOR, PBGA740 |
| MPC8377ECVRANGA | 32-BIT, 400 MHz, MICROPROCESSOR, PBGA689 |
| MPC8377EVRALGA | 32-BIT, 400 MHz, MICROPROCESSOR, PBGA689 |
| MPC8377EVRANGA | 32-BIT, 400 MHz, MICROPROCESSOR, PBGA689 |
| MPC8378ECVRALGA | 32-BIT, 400 MHz, MICROPROCESSOR, PBGA689 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC8360ZUAJDHA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications |
| MPC8360ZUAJFGA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications |
| MPC8360ZUAJFHA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications |
| MPC8360ZUALDGA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications |
| MPC8360ZUALDHA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。