參數資料
型號: MPC8360VVALFH
廠商: Freescale Semiconductor
文件頁數: 10/102頁
文件大?。?/td> 0K
描述: IC MPU PWRQUICC II 740-TBGA
標準包裝: 21
系列: MPC83xx
處理器類型: 32-位 MPC83xx PowerQUICC II Pro
速度: 667MHz
電壓: 1.3V
安裝類型: 表面貼裝
封裝/外殼: 740-LBGA
供應商設備封裝: 740-TBGA(37.5x37.5)
包裝: 托盤
配用: MPC8360EA-MDS-PB-ND - KIT APPLICATION DEV 8360 SYSTEM
MPC8360E-RDK-ND - BOARD REFERENCE DESIGN FOR MPC
MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 5
Freescale Semiconductor
15
DC Electrical Characteristics
4.1
DC Electrical Characteristics
This table provides the clock input (CLKIN/PCI_SYNC_IN) DC timing specifications for the device.
4.2
AC Electrical Characteristics
The primary clock source for the device can be one of two inputs, CLKIN or PCI_CLK, depending on whether the device is
configured in PCI host or PCI agent mode. This table provides the clock input (CLKIN/PCI_CLK) AC timing specifications for
the device.
4.3
Gigabit Reference Clock Input Timing
This table provides the Gigabit reference clocks (GTX_CLK125) AC timing specifications.
Table 7. CLKIN DC Electrical Characteristics
Parameter
Condition
Symbol
Min
Max
Unit
Input high voltage
VIH
2.7
OVDD + 0.3
V
Input low voltage
VIL
–0.3
0.4
V
CLKIN input current
0 V
≤VIN ≤OVDD
IIN
—±10
μA
PCI_SYNC_IN input current
0 V
≤VIN ≤0.5V or
OVDD – 0.5V ≤VIN ≤OVDD
IIN
—±10
μA
PCI_SYNC_IN input current
0.5 V
≤VIN ≤OVDD – 0.5 V
IIN
±100
μA
Table 8. CLKIN AC Timing Specifications
Parameter/Condition
Symbol
Min
Typical
Max
Unit
Notes
CLKIN/PCI_CLK frequency
fCLKIN
66.67
MHz
CLKIN/PCI_CLK cycle time
tCLKIN
15
ns
CLKIN/PCI_CLK rise and fall time
tKH, tKL
0.6
1.0
2.3
ns
CLKIN/PCI_CLK duty cycle
tKHK/tCLKIN
40
60
%
CLKIN/PCI_CLK jitter
±150
ps
Notes:
1. Caution: The system, core, USB, security, and 10/100/1000 Ethernet must not exceed their respective maximum or
minimum operating frequencies.
2. Rise and fall times for CLKIN/PCI_CLK are measured at 0.4 V and 2.7 V.
3. Timing is guaranteed by design and characterization.
4. This represents the total input jitter—short term and long term—and is guaranteed by design.
5. The CLKIN/PCI_CLK driver’s closed loop jitter bandwidth should be <500 kHz at –20 dB. The bandwidth must be set low
to allow cascade-connected PLL-based devices to track CLKIN drivers with the specified jitter.
Table 9. GTX_CLK125 AC Timing Specifications
At recommended operating conditions with LVDD = 2.5 ± 0.125 mV/ 3.3 V ± 165 mV
Parameter/Condition
Symbol
Min
Typical
Max
Unit
Notes
GTX_CLK125 frequency
tG125
—125
MHz
GTX_CLK125 cycle time
tG125
—8
ns
相關PDF資料
PDF描述
IDT70V7339S166BC IC SRAM 9MBIT 166MHZ 256BGA
IDT70V7519S166BF IC SRAM 9MBIT 166MHZ 208FBGA
IDT70V7339S166BFG IC SRAM 9MBIT 166MHZ 208FBGA
IDT70V7339S166BF IC SRAM 9MBIT 166MHZ 208FBGA
IDT70T3599S133BF IC SRAM 4MBIT 133MHZ 208FBGA
相關代理商/技術參數
參數描述
MPC8360VVALFHA 功能描述:微處理器 - MPU 8360 TBGA NON-ENC NO-PB RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8360ZUADDH 功能描述:微處理器 - MPU 8360 TBGA NON-ENCRP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8360ZUAGDG 功能描述:微處理器 - MPU 8360 TBGA NON-ENCRP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8360ZUAGDGA 功能描述:微處理器 - MPU 8360 TBGA NON-ENCRP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8360ZUAGDHA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications