參數(shù)資料
型號(hào): MPC8349EVVAJFB
廠商: Freescale Semiconductor
文件頁數(shù): 51/87頁
文件大?。?/td> 0K
描述: IC MPU POWERQUICC II 672-TBGA
標(biāo)準(zhǔn)包裝: 24
系列: MPC83xx
處理器類型: 32-位 MPC83xx PowerQUICC II Pro
速度: 533MHz
電壓: 1.2V
安裝類型: 表面貼裝
封裝/外殼: 672-LBGA
供應(yīng)商設(shè)備封裝: 672-TBGA(35x35)
包裝: 托盤
配用: MPC8349E-MITX-GP-ND - KIT REFERENCE PLATFORM MPC8349E
MPC8349E-MITXE-ND - BOARD REFERENCE FOR MPC8349
MPC8349EA-MDS-PB-ND - KIT MODULAR DEV SYSTEM MPC8349E
MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 13
Freescale Semiconductor
55
Package and Pin Listings
18.2
Mechanical Dimensions for the MPC8349EA TBGA
Figure 40 shows the mechanical dimensions and bottom surface nomenclature for the MPC8349EA,
672-TBGA package.
Figure 40. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC8349EA TBGA
Notes:
1. All dimensions are in millimeters.
2. Dimensions and tolerances per ASME Y14.5M-1994.
3. Maximum solder ball diameter measured parallel to datum A.
4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls.
5. Parallelism measurement must exclude any effect of mark on top surface of package.
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