參數(shù)資料
型號(hào)： MPC8347VVAGDA
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 400 MHz, MICROPROCESSOR, PBGA672
封裝： 35 X 35 MM, 1.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, TBGA-672
文件頁數(shù)： 9/120頁
文件大?。?/td> 1349K
代理商： MPC8347VVAGDA
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 2
106
Freescale Semiconductor
Thermal
20.2.4
Heat Sinks and Junction-to-Case Thermal Resistance
Some application environments require a heat sink to provide the necessary thermal management of the
device. When a heat sink is used, the thermal resistance is expressed as the sum of a junction to case
thermal resistance and a case-to-ambient thermal resistance:
RθJA = RθJC + RθCA
where:
RθJA = junction to ambient thermal resistance (°C/W)
RθJC = junction to case thermal resistance (°C/W)
RθCA = case to ambient thermal resistance (°C/W)
RθJC is device-related and cannot be influenced by the user. The user controls the thermal environment to
change the case to ambient thermal resistance, RθCA. For instance, the user can change the size of the heat
sink, the air flow around the device, the interface material, the mounting arrangement on printed circuit
board, or change the thermal dissipation on the printed circuit board surrounding the device.
The thermal performance of devices with heat sinks has been simulated with a few commercially available
heat sinks. The heat sink choice is determined by the application environment (temperature, air flow,
adjacent component power dissipation) and the physical space available. Because there is not a standard
application environment, a standard heat sink is not required.
Table 66 and Table 67 show heat sink thermal resistance for TBGA and PBGA of the MPC8347EA.
Table 66. Heat Sink and Thermal Resistance of MPC8347EA (TBGA)
Heat Sink Assuming Thermal Grease
Air Flow
35
× 35 mm TBGA
Thermal Resistance
AAVID 30
× 30 × 9.4 mm Pin Fin
Natural Convection
10
AAVID 30
× 30 × 9.4 mm Pin Fin
1 m/s
6.5
AAVID 30
× 30 × 9.4 mm Pin Fin
2 m/s
5.6
AAVID 31
× 35 × 23 mm Pin Fin
Natural Convection
8.4
AAVID 31
× 35 × 23 mm Pin Fin
1 m/s
4.7
AAVID 31
× 35 × 23 mm Pin Fin
2 m/s
4
Wakefield, 53
× 53 × 25 mm Pin Fin
Natural Convection
5.7
Wakefield, 53
× 53 × 25 mm Pin Fin
1 m/s
3.5
Wakefield, 53
× 53 × 25 mm Pin Fin
2 m/s
2.7
MEI, 75
× 85 × 12 no adjacent board, extrusion
Natural Convection
6.7
MEI, 75
× 85 × 12 no adjacent board, extrusion
1 m/s
4.1
MEI, 75
× 85 × 12 no adjacent board, extrusion
2 m/s
2.8
MEI, 75
× 85 × 12 mm, adjacent board, 40 mm Side bypass
1 m/s
3.1
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參數(shù)描述
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MPC8347VVAJDB 功能描述:微處理器 - MPU 8349 TBGA NO-PB W/O ENC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8347VVAJDB 制造商:Freescale Semiconductor 功能描述:Embedded Networking Processor
MPC8347VVAJF 功能描述:IC MPU PWRQUICC II PRO 672-TBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC83xx 標(biāo)準(zhǔn)包裝:1 系列:MPC85xx 處理器類型:32-位 MPC85xx PowerQUICC III 特點(diǎn):- 速度:1.2GHz 電壓:1.1V 安裝類型:表面貼裝 封裝/外殼:783-BBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:783-FCPBGA（29x29） 包裝:托盤
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