• 參數(shù)資料
    型號: MPC8323ECVRADDC
    廠商: Freescale Semiconductor
    文件頁數(shù): 69/82頁
    文件大?。?/td> 0K
    描述: IC MPU PWRQUICC II 516-PBGA
    產(chǎn)品培訓(xùn)模塊: MPC8323E PowerQUICC II Pro Processor
    標(biāo)準(zhǔn)包裝: 40
    系列: MPC83xx
    處理器類型: 32-位 MPC83xx PowerQUICC II Pro
    速度: 266MHz
    電壓: 1V
    安裝類型: 表面貼裝
    封裝/外殼: 516-BBGA
    供應(yīng)商設(shè)備封裝: 516-FPBGA(27x27)
    包裝: 托盤
    配用: MPC8323E-RDB-ND - BOARD REFERENCE DESIGN
    MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4
    Freescale Semiconductor
    71
    Thermal
    22.7
    Suggested PLL Configurations
    To simplify the PLL configurations, the MPC8323E might be separated into two clock domains. The first
    domain contain the CSB PLL and the core PLL. The core PLL is connected serially to the CSB PLL, and
    has the csb_clk as its input clock. The second clock domain has the QUICC Engine PLL. The clock
    domains are independent, and each of their PLLs are configured separately. Both of the domains has one
    common input clock. Table 63 shows suggested PLL configurations for 33, 25, and 66 MHz input clocks.
    23 Thermal
    This section describes the thermal specifications of the MPC8323E.
    23.1
    Thermal Characteristics
    Table 64 provides the package thermal characteristics for the 516 27
    × 27 mm PBGA of the MPC8323E.
    Table 63. Suggested PLL Configurations
    Conf No.
    SPMF
    Core
    PLL
    CEMF
    CEDF
    Input Clock
    Frequency
    (MHz)
    CSB
    Frequency
    (MHz)
    Core
    Frequency
    (MHz)
    QUICC
    Engine
    Frequency
    (MHz)
    1
    0100
    0000100
    0110
    0
    33.33
    133.33
    266.66
    200
    2
    0100
    0000101
    1000
    0
    25
    100
    250
    200
    3
    0010
    0000100
    0011
    0
    66.67
    133.33
    266.66
    200
    4
    0100
    0000101
    0110
    0
    33.33
    133.33
    333.33
    200
    5
    0101
    0000101
    1000
    0
    25
    125
    312.5
    200
    6
    0010
    0000101
    0011
    0
    66.67
    133.33
    333.33
    200
    Table 64. Package Thermal Characteristics for PBGA
    Characteristic
    Board type
    Symbol
    Value
    Unit
    Notes
    Junction-to-ambient natural convection
    Single-layer board (1s)
    RθJA
    28
    °C/W
    1, 2
    Junction-to-ambient natural convection
    Four-layer board (2s2p)
    RθJA
    21
    °C/W
    1, 2, 3
    Junction-to-ambient (@200 ft/min)
    Single-layer board (1s)
    RθJMA
    23
    °C/W
    1, 3
    Junction-to-ambient (@200 ft/min)
    Four-layer board (2s2p)
    RθJMA
    18
    °C/W
    1, 3
    Junction-to-board
    RθJB
    13
    °C/W
    4
    Junction-to-case
    RθJC
    9°C/W
    5
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