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| 型號(hào)： | MPC8315VRADDA |
| 廠(chǎng)商： | Freescale Semiconductor |
| 文件頁(yè)數(shù)： | 104/106頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | MPU POWERQUICC II PRO 620-PBGA |
| 標(biāo)準(zhǔn)包裝： | 36 |
| 系列： | MPC83xx |
| 處理器類(lèi)型： | 32-位 MPC83xx PowerQUICC II Pro |
| 速度： | 266MHz |
| 電壓： | 1V |
| 安裝類(lèi)型： | 表面貼裝 |
| 封裝/外殼： | 620-BBGA 裸露焊盤(pán) |
| 供應(yīng)商設(shè)備封裝： | 620-PBGA（29x29） |
| 包裝： | 托盤(pán) |
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MPC8315E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
97
Thermal
25.2.3
Experimental Determination of Junction Temperature
To determine the junction temperature of the device in the application after prototypes are available, the
Thermal Characterization Parameter (
JT) can be used to determine the junction temperature with a
measurement of the temperature at the top center of the package case using the following equation:
TJ = TT + (JT PD)
where:
TJ = junction temperature (C)
TT = thermocouple temperature on top of package (C)
JT = junction to ambient thermal resistance (C/W)
PD = power dissipation in the package (W)
The thermal characterization parameter is measured per JESD51-2 specification using a 40 gauge type T
thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so
that the thermocouple junction rests on the package. A small amount of epoxy is placed over the
thermocouple junction and over about 1 mm of wire extending from the junction. The thermocouple wire
is placed flat against the package case to avoid measurement errors caused by cooling effects of the
thermocouple wire.
25.2.4
Heat Sinks and Junction-to-Case Thermal Resistance
In some application environments, a heat sink is required to provide the necessary thermal management of
the device. When a heat sink is used, the thermal resistance is expressed as the sum of a junction to case
thermal resistance and a case to ambient thermal resistance:
RJA = RJC + RCA
where:
RJA = junction to ambient thermal resistance (C/W)
RJC = junction to case thermal resistance (C/W)
RCA = case to ambient thermal resistance (C/W)
RJC is device related and cannot be influenced by the user. The user controls the thermal environment to
change the case to ambient thermal resistance, RCA. For instance, the user can change the size of the heat
sink, the air flow around the device, the interface material, the mounting arrangement on printed circuit
board, or change the thermal dissipation on the printed circuit board surrounding the device.
To illustrate the thermal performance of the devices with heat sinks, the thermal performance has been
simulated with a few commercially available heat sinks. The heat sink choice is determined by the
application environment (temperature, air flow, adjacent component power dissipation) and the physical
space available. Because there is not a standard application environment, a standard heat sink is not
required.
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