MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
93
Thermal
Accurate thermal design requires thermal modeling of the application environment using computational
fluid dynamics software which can model both the conduction cooling and the convection cooling of the
air moving through the application. Simplified thermal models of the packages can be assembled using the
junction-to-case and junction-to-board thermal resistances listed in the thermal resistance table. More
detailed thermal models can be made available on request.
Heat sink vendors include the following list:
Aavid Thermalloy
603-224-9988
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Alpha Novatech
408-749-7601
473 Sapena Ct. #12
Santa Clara, CA 95054
Internet: www.alphanovatech.com
International Electronic Research Corporation (IERC) 818-842-7277
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Table 75. Heat Sinks and Junction-to-Case Thermal Resistance of MPC8314E TEPBGA II
Heat Sink Assuming Thermal Grease
Air Flow
29
29 mm TEBGA II
Junction-to-Ambient
Thermal Resistance
AAVID 30 x 30 x 9.4 mm Pin Fin
Natural Convection
14.4
AAVID 30 x 30 x 9.4 mm Pin Fin
0.5 m/s
11.4
AAVID 30 x 30 x 9.4 mm Pin Fin
1 m/s
10.1
AAVID 30 x 30 x 9.4 mm Pin Fin
2 m/s
8.9
AAVID 35 x 31 x 23 mm Pin Fin
Natural Convection
12.3
AAVID 35 x 31 x 23 mm Pin Fin
0.5 m/s
9.3
AAVID 35 x 31 x 23 mm Pin Fin
1 m/s
8.5
AAVID 35 x 31 x 23 mm Pin Fin
2 m/s
7.9
AAVID 43 x 41 x 16.5 mm Pin Fin
Natural Convection
12.5
AAVID 43 x 41 x 16.5 mm Pin Fin
0.5 m/s
9.7
AAVID 43 x 41 x 16.5 mm Pin Fin
1 m/s
8.5
AAVID 43 x 41 x 16.5 mm Pin Fin
2 m/s
7.7
Wakefield, 53 x 53 x 25 mm Pin Fin
Natural Convection
10.9
Wakefield, 53 x 53 x 25 mm Pin Fin
0.5 m/s
8.5
Wakefield, 53 x 53 x 25 mm Pin Fin
1 m/s
7.5
Wakefield, 53 x 53 x 25 mm Pin Fin
2 m/s
7.1