參數(shù)資料
型號： MPC8314EVRAGDA
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： MICROPROCESSOR, PBGA620
封裝： 29 X 29 MM, LEAD FREE, PLASTIC, TEPBGA-620
文件頁數(shù)： 103/106頁
文件大?。?/td> 1253K
代理商： MPC8314EVRAGDA
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 0
96
Freescale Semiconductor
Thermal (Preliminary)
24 Thermal (Preliminary)
This section describes the thermal specifications of the MPC8314E.
24.1
Thermal Characteristics
Table 74 provides the package thermal characteristics for the 620 29
× 29 mm TEPBGA II.
3
0010
0000100
66.67
133.33
266.66
4
0100
0000101
33.33
133.33
333.33
5
0101
0000101
25
125
312.5
6
0010
0000101
66.67
133.33
333.33
7
0101
0000110
25
125
375
8
0100
0000110
33.33
133.33
400
9
0010
0000110
66.67
133.33
400
Table 74. Package Thermal Characteristics for TEPBGA II
Characteristic
Board type
Symbol
Value
Unit
Notes
Junction to ambient natural convection
Single layer board (1s)
RθJA
23
°C/W
1, 2
Junction to ambient natural convection
Four layer board (2s2p)
RθJA
16
°C/W
1, 2, 3
Junction to ambient (@200 ft/min)
Single layer board (1s)
RθJMA
18
°C/W
1, 3
Junction to ambient (@200 ft/min)
Four layer board (2s2p)
RθJMA
13
°C/W
1, 3
Junction to board
—
RθJB
8°C/W
4
Junction to case
—
RθJC
6°C/W
5
Junction to package top
Natural convection
Ψ
JT
6°C/W
6
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2. Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured
on the top surface of the board near the package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
6. Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
as Psi-JT.
Table 73. Suggested PLL Configurations
Conf. No.
SPMF
Core\PLL
Input Clock Frequency (MHz) CSB Frequency (MHz) Core Frequency (MHz)
相關PDF資料
PDF描述
MPC8315EVRAFDA 32-BIT, 333 MHz, MICROPROCESSOR, PBGA620
MPC8315EVRADDA 32-BIT, 266 MHz, MICROPROCESSOR, PBGA620
MPC8315EVRAGDA 32-BIT, 400 MHz, MICROPROCESSOR, PBGA620
MPC8315VRAFDA 32-BIT, 333 MHz, MICROPROCESSOR, PBGA620
MPC8321EVRAFDCA 32-BIT, 333 MHz, RISC PROCESSOR, PBGA516
相關代理商/技術參數(shù)
參數(shù)描述
MPC8314VRADDA 功能描述:微處理器 - MPU NON-ENCRYPT RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8314VRAFDA 功能描述:微處理器 - MPU NON-ENCRYPT RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8314VRAGDA 功能描述:微處理器 - MPU NON-ENCRYPT RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8315 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MPC8315E PowerQUICC II Pro Processor Hardware Specifications
MPC8315CVRADDA 功能描述:微處理器 - MPU NON-ENCRYPT RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
發(fā)布緊急采購，3分鐘左右您將得到回復。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*